Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies

ABSTRACT

An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.

RELATED APPLICATIONS

The present application claims the benefit of priority as acontinuation-in-part (CIP) of U.S. application Ser. No. 13/027,006 filedFeb. 14, 2011, and entitled “Light Emitting Diode (LED) Arrays IncludingDirect Die Attach And Related Assemblies” which claims the benefit ofpriority as a continuation-in-part (CIP) of U.S. application Ser. No.13/018,013 filed Jan. 31, 2011, and entitled “Horizontal Light EmittingDiodes Including Phosphor Particles.” The present application alsoclaims the benefit of priority of U.S. Provisional Application No.61/589,173 filed Jan. 20, 2012. The disclosures of all of the abovereferenced applications are hereby incorporated herein in theirentireties by reference.

BACKGROUND

This invention relates to semiconductor light emitting devices andassemblies and methods of manufacturing the same, and more particularly,to semiconductor Light Emitting Diodes (LEDs) and assemblies thereof.

Semiconductor LEDs are widely known solid-state lighting elements thatare capable of generating light upon application of voltage thereto.LEDs generally include a diode region having first and second opposingfaces, and including therein an n-type layer, a p-type layer and a p-njunction. An anode contact ohmically contacts the p-type layer and acathode contact ohmically contacts the n-type layer. The diode regionmay be epitaxially formed on a substrate, such as a sapphire, silicon,silicon carbide, gallium arsenide, gallium nitride, etc., growthsubstrate, but the completed device may not include a substrate. Thediode region may be fabricated, for example, from silicon carbide,gallium nitride, gallium phosphide, aluminum nitride and/or galliumarsenide-based materials and/or from organic semiconductor-basedmaterials. Finally, the light radiated by the LED may be in the visibleor ultraviolet (UV) regions, and the LED may incorporate wavelengthconversion material such as phosphor.

LEDs are increasingly being used in lighting/illumination applications,with a goal being to provide a replacement for the ubiquitousincandescent light bulb.

LEDs are increasingly being used in lighting/illumination applications,with a goal being to provide a replacement for ubiquitous incandescentand fluorescent lighting. To accomplish the goal of replacingtraditional lighting with LED lighting, LED lighting designers are facedwith stringent dimensional, energy efficiency and luminous flux outputrequirements. Such requirements have caused LED designers to produce LEDarrays in varying arrangements. Typical LED arrangements involve the useof wire bonds. The use of wire bonds creates a constraint on the densitywith which individual LED chips can be packaged together due tomechanical or manufacturing constraints and problems with lightabsorption, for example due to the wire bond pads. The use of monolithicLED chip arrays can resolve some of the issues with wire bond pads, butthe monolithic LED chips may add increased costs, limited shapes andreduced yield.

SUMMARY

Some embodiments of the present invention may provide small area LEDswith LED arrays for various applications, such as higher voltageapplications, where LED chip bonding area is more efficiently used tobalance practical aspects of maintaining a chip spacing that providesease of manufacture, improved yield and/or less light absorption toprovide more efficient and/or improved light output. Depending on thedimensional requirements and desired operating voltage, the packaged LEDarray can provide different serial/parallel configurations. The packagedLED array can use wirebond-free LEDs which are individually selectedand/or reflow bonded to a packaging substrate. In certain embodiments,the packaging substrate includes small conductive islands, and LED chipscan bridge the smaller conductive islands to electrically couple the LEDchips in series. The packaging substrate can include larger conductiveislands or contiguous conductive pads to electrically couple the LEDchips in parallel. In some embodiments, different sized and/or shapedconductive pads or islands can be used to provide the desired serialand/or parallel configuration for the LED array in a desired shape.

According to some embodiments, an electronic device may include apackaging substrate having a packaging face, with the packagingsubstrate including positive and negative electrically conductive padson the packaging face. A plurality of light emitting diodes may beelectrically and mechanically coupled to the packaging face of thepackaging substrate, with the plurality of light emitting diodes beingelectrically coupled between the positive and negative electricallyconductive pads on the packaging face. In addition, a continuous opticalcoating may be provided on the plurality of light emitting diodes and onthe packaging face of the packaging substrate so that the plurality oflight emitting diodes are between the optical coating and the packagingsubstrate, and an optic area may be defined by an area of the packagingface covered by the continuous optical coating. More particularly, theplurality of light emitting diodes may be configured to generate atleast 20 lumens per square millimeter of the optic area while deliveringat least 100 lumens per watt of power consumed by the plurality of lightemitting diodes between the continuous optical coating and the packagingsubstrate. Still more particularly, the plurality of light emittingdiodes may be configured to generate at least 25 lumens per squaremillimeter of the optic area while delivering at least 100 lumens perwatt of power consumed, and/or the electronic device of Claim 1 whereinthe optic area is in the range of about 20 square millimeters to about200 square millimeters.

The plurality of light emitting diodes may include at least 2 lightemitting diodes between the continuous optical coating and the packagingsubstrate, at least 6 light emitting diodes between the continuousoptical coating and the packaging substrate, at least 16 light emittingdiodes between the continuous optical coating and the packagingsubstrate, at least 72 light emitting diodes between the continuousoptical coating and the packaging substrate, at least 98 light emittingdiodes between the continuous optical coating and the packagingsubstrate, at least 108 light emitting diodes between the continuousoptical coating and the packaging substrate, at least 192 light emittingdiodes between the continuous optical coating and the packagingsubstrate, or even at least 200 light emitting diodes between thecontinuous optical coating and the packaging substrate.

At least one of the light emitting diodes is free of wirebonds. Forexample, at least one of the light emitting diodes may include an anodecontact electrically and mechanically coupled to the packaging substrateusing a first metallic bond (e.g., a first solder bond) physicallylocated between the anode contact and the packaging substrate and acathode contact electrically and mechanically coupled to the packagingsubstrate using a second metallic bond (e.g., a second solder bond)physically located between the cathode contact and the packagingsubstrate. More particularly, each of the plurality of light emittingdiodes may include a diode region having first and second opposing facesincluding therein an n-type layer and a p-type layer, an anode contactthat ohmically contacts the p-type layer and extends on the first face,a cathode contact that ohmically contacts the n-type layer and extendson the first face, and a support substrate on the second face of thediode region, with the diode region being between the support substrateand the anode and cathode contacts, and with the support substratehaving a thickness of at least about 50 micrometers. Moreover, for eachof the plurality of light emitting diodes, the diode region may bebetween the support substrate and the packaging substrate.

The continuous optical coating include a layer of a transparent and/ortranslucent material including a phosphor material therein. Moreover, athickness of the continuous optical coating relative to the packagingface of the packaging substrate may be greater than a thickness of eachof the plurality of light emitting diodes relative to the packaging faceof the packaging substrate, and a surface of the continuous opticalcoating opposite the packaging substrate may be substantially planarover an area including the plurality of light emitting diodes.

The packaging substrate may also have a backside face opposite thepackaging face. Moreover, the packaging substrate may further include afirst backside contact electrically coupled to the positive electricallyconductive pad through a first electrically conductive via through thepackaging substrate, and a second backside contact electrically coupledto the negative electrically conductive pad through a secondelectrically conductive via through the packaging substrate. Inaddition, the packaging substrate may include an aluminum nitridesubstrate, and a metal heat conducting structure on the backside face.The metal heat conducting structure may be electrically isolated fromthe first and second backside contacts, and the metal heat conductingstructure may be aligned with the plurality of light emitting diodes ina direction perpendicular with respect to the packaging face of thepackaging substrate.

The plurality of light emitting diodes may include a first string oflight emitting diodes electrically coupled in series between thepositive and negative electrically conductive pads, and a second stringof light emitting diodes electrically coupled in series between thepositive and negative electrically conductive pads. In addition, a nodebetween two light emitting diodes of the first string may beelectrically coupled to a node between two light emitting diodes of thesecond string, and at least one of the plurality of light emittingdiodes may be electrically coupled to the packaging substrate using nomore than one wirebond.

The continuous optical coating may include a layer of a transparentand/or translucent material including different first and secondphosphor materials therein, with the first and second phosphor materialsbeing configured to emit different wavelengths of light.

The plurality of light emitting diodes may be configured to generate atleast 20 lumens per square millimeter of the optic area while deliveringat least 100 lumens per watt of power consumed by the plurality of lightemitting diodes between the continuous optical coating and the packagingsubstrate and while delivering at least 600 absolute lumens, at least800 lumens, at least 1100 lumens, or even at least 1500 lumens from theplurality of light emitting diodes between the continuous opticalcoating and the packaging substrate.

The plurality of light emitting diodes may include first and secondlight emitting diodes between the continuous optical coating and thepackaging substrate with the first and second light emitting diodesbeing spaced apart by a distance in the range of about 20 micrometers toabout 500 micrometers.

According to some other embodiments, an electronic device may include apackaging substrate having a packaging face, the packaging substrateincluding positive and negative electrically conductive pads on thepackaging face. A plurality of light emitting diodes may be electricallyand mechanically coupled to the packaging face of the packagingsubstrate, with the plurality of light emitting diodes beingelectrically coupled between the positive and negative electricallyconductive pads on the packaging face. A continuous optical coating maybe provided on the plurality of light emitting diodes and on thepackaging face of the packaging substrate so that the plurality of lightemitting diodes are between the optical coating and the packagingsubstrate. A thickness of the continuous optical coating relative to thepackaging face of the packaging substrate may be greater than athickness of each of the plurality of light emitting diodes relative tothe packaging face of the packaging substrate, and a surface of thecontinuous optical coating opposite the packaging substrate may besubstantially planar over an area including the plurality of lightemitting diodes, and at least one of the plurality of light emittingdiodes may be free of wirebonds.

An optic area may be defined by an area of the packaging face covered bythe continuous optical coating, and the plurality of light emittingdiodes may be configured to generate at least 20 lumens per squaremillimeter of the optic area while delivering at least 100 lumens perwatt of power consumed by the plurality of light emitting diodes betweenthe continuous optical coating and the packaging substrate.

The plurality of light emitting diodes may include at least 2 lightemitting diodes, at least 6 light emitting diodes, at least 16 lightemitting diodes, at least 72 light emitting diodes, at least 98 lightemitting diodes, at least 108 light emitting diodes, at least 192 lightemitting diodes, or even at least 200 light emitting diodes. At leastone of the light emitting diodes may include an anode contactelectrically and mechanically coupled to the packaging substrate using afirst metallic bond located between the anode contact and the packagingsubstrate and a cathode contact electrically and mechanically coupled tothe packaging substrate using a second metallic bond located between thecathode contact and the packaging substrate.

Each of the plurality of light emitting diodes may include a dioderegion having first and second opposing faces including therein ann-type layer and a p-type layer, an anode contact that ohmicallycontacts the p-type layer and extends on the first face, a cathodecontact that ohmically contacts the n-type layer and extends on thefirst face, and a support substrate on the second face of the dioderegion. Moreover, the diode region may be between the support substrateand the anode and cathode contacts, and the support substrate may have athickness of at least about 50 micrometers. For each of the plurality oflight emitting diodes, the diode region may be between the supportsubstrate and the packaging substrate. The continuous optical coatingmay include a layer of a transparent and/or translucent materialincluding a phosphor material therein.

The packaging substrate may have a backside face opposite the packagingface, and the packaging substrate may further include a first backsidecontact electrically coupled to the positive electrically conductive padthrough a first electrically conductive via, and a second backsidecontact electrically coupled to the negative electrically conductive padthrough a second electrically conductive via. The packaging substratemay include a thermally conductive and electrically insulating materialand a metal heat conducting structure on the backside face. The metalheat conducting structure may be electrically isolated from the firstand second backside contacts, and the metal heat conducting structuremay be aligned with the plurality of light emitting diodes in adirection perpendicular with respect to the packaging face of thepackaging substrate.

The plurality of light emitting diodes may include a first string oflight emitting diodes electrically coupled in series between thepositive and negative electrically conductive pads, and a second stringof light emitting diodes electrically coupled in series between thepositive and negative electrically conductive pads. A node between twolight emitting diodes of the first string may be electrically coupled toa node between two light emitting diodes of the second string, and atleast one of the plurality of light emitting diodes may be free ofwirebonds.

The continuous optical coating may include a layer of a transparentand/or translucent material including different first and secondphosphor materials therein, and the first and second phosphor materialsmay be configured to emit different wavelengths of light. In addition, adam may surround the plurality of light emitting diodes, with thecontinuous optical coating being confined within the dam.

According to still other embodiments, an electronic device may include apackaging substrate having a packaging face with the packaging substrateincluding positive and negative electrically conductive pads on thepackaging face. A plurality of light emitting diodes may be electricallyand mechanically coupled to the packaging face of the packagingsubstrate, with the plurality of light emitting diodes beingelectrically coupled between the positive and negative electricallyconductive pads on the packaging face. The plurality of light emittingdiodes may include a first string of light emitting diodes electricallycoupled in series between the positive and negative electricallyconductive pads, and a second string of light emitting diodeselectrically coupled in series between the positive and negativeelectrically conductive pads. A node between two light emitting diodesof the first string may be electrically coupled to a node between twolight emitting diodes of the second string, and at least one of theplurality of light emitting diodes may be electrically coupled to thepackaging substrate using no more than one wirebond.

A continuous optical coating may be provided on the plurality of lightemitting diodes and on the packaging face of the packaging substrate sothat the plurality of light emitting diodes are between the opticalcoating and the packaging substrate. An optic area may be defined by anarea of the packaging face covered by the continuous optical coating,and the plurality of light emitting diodes may be configured to generateat least 20 lumens per square millimeter of the optic area whiledelivering at least 100 lumens per watt of power consumed by theplurality of light emitting diodes between the continuous opticalcoating and the packaging substrate.

The plurality of light emitting diodes may include at least 2 lightemitting diodes, at least 6 light emitting diodes, at least 16 lightemitting diodes, at least 72 light emitting diodes, at least 98 lightemitting diodes, at least 108 light emitting diodes, at least 192 lightemitting diodes, or even at least 200 light emitting diodes. Moreover,at least one of the light emitting diodes may be free of wirebonds.

At least one of the light emitting diodes may include an anode contactelectrically and mechanically coupled to the packaging substrate using afirst metallic bond physically located between the anode contact and thepackaging substrate and a cathode contact electrically and mechanicallycoupled to the packaging substrate using a second metallic bondphysically located between the cathode contact and the packagingsubstrate.

Each of the plurality of light emitting diodes may include a dioderegion having first and second opposing faces including therein ann-type layer and a p-type layer, an anode contact that ohmicallycontacts the p-type layer and extends on the first face, a cathodecontact that ohmically contacts the n-type layer and extends on thefirst face, and a support substrate on the second face of the dioderegion. More particularly, the diode region may be between the supportsubstrate and the anode and cathode contacts, and the support substratemay have a thickness of at least about 50 micrometers. For each of theplurality of light emitting diodes, the diode region may be between thesupport substrate and the packaging substrate.

The continuous optical coating may include a layer of a transparentand/or translucent material including a phosphor material therein. Athickness of the continuous optical coating relative to the packagingface of the packaging substrate may be greater than a thickness of eachof the plurality of light emitting diodes relative to the packaging faceof the packaging substrate, and a surface of the continuous opticalcoating opposite the packaging substrate may be substantially planarover an area including the plurality of light emitting diodes.

The packaging substrate may have a backside face opposite the packagingface. The packaging substrate may further include a first backsidecontact electrically coupled to the positive electrically conductive padthrough a first electrically conductive via through the packagingsubstrate, and a second backside contact electrically coupled to thenegative electrically conductive pad through a second electricallyconductive via through the packaging substrate. The packaging substratemay include an aluminum nitride substrate, and a metal heat conductingstructure on the backside face with the metal heat conducting structurebeing electrically isolated from the first and second backside contacts.Moreover, the metal heat conducting structure may be aligned with theplurality of light emitting diodes in a direction perpendicular withrespect to the packaging face of the packaging substrate.

Moreover, the continuous optical coating may include a layer of atransparent and/or translucent material including different first andsecond phosphor materials therein, wherein the first and second phosphormaterials are configured to emit different wavelengths of light.

According to yet other embodiments, an electronic device may include apackaging substrate having a packaging face, with the packagingsubstrate including positive and negative electrically conductive padson the packaging face. A plurality of light emitting diodes may beelectrically and mechanically coupled to the packaging face of thepackaging substrate, and the plurality of light emitting diodes may beelectrically coupled between the positive and negative electricallyconductive pads on the packaging face. Moreover, each of the pluralityof light emitting diodes may have a forward voltage drop in the range ofabout 2.5 volts to about 3.5 volts, the plurality of light emittingdiodes may be configured to provide a combined forward voltage dropbetween the positive and negative electrically conductive pads of atleast about 36 volts, and at least one of the plurality of lightemitting diodes may be free of wirebonds.

The plurality of light emitting diodes may include at least two lightemitting diodes electrically coupled in series, at least 6 lightemitting diodes electrically coupled in series, at least 16 lightemitting diodes electrically coupled in series, at least 72 lightemitting diodes electrically coupled in series, at least 98 lightemitting diodes electrically coupled in series, at least 108 lightemitting diodes electrically coupled in series, at least 192 lightemitting diodes electrically coupled in series, or even at least 200light emitting diodes electrically coupled in series. For example, theplurality of light emitting diodes may include at least 70 lightemitting diodes electrically coupled in series between the positive andnegative electrically conductive pads, and the plurality of lightemitting diodes may be configured to provide a combined forward voltagedrop between the positive and negative electrically conductive pads ofat least about 200 volts. Moreover, the plurality of light emittingdiodes may include at least 75 light emitting diodes electricallycoupled in series between the positive and negative electricallyconductive pads, and the plurality of light emitting diodes may beconfigured to provide a combined forward voltage drop between thepositive and negative electrically conductive pads of at least about 220volts.

The packaging substrate may include a plurality of electricallyconductive islands providing electrical coupling between respective onesof the plurality of light emitting diodes between the positive andnegative electrically conductive pads. The electrically conductiveislands and the positive and negative electrically conductive pads maydefine a reflective area on the packaging substrate surrounding theplurality of light emitting diodes, and at least one of the electricallyconductive islands may extend to an edge of the reflective area adjacentto the one of the positive and/or negative electrically conductive padswith an electrically insulating gap defined therebetween. The at leastone of the electrically conductive islands may include a firstelectrically conductive island, and a second one of the electricallyconductive islands may extend to the edge of the reflective areaadjacent to the first electrically conductive island with anelectrically insulating gap defined between the first and secondelectrically conductive islands.

The packaging substrate may include a plurality of electricallyconductive islands providing electrical coupling between respective onesof the plurality of light emitting diodes between the positive andnegative electrically conductive pads. The packaging substrate mayinclude an electrically conductive reflector layer adjacent at least oneof the plurality of electrically conductive islands and adjacent atleast one of the positive and/or negative electrically conductive pads.The electrically conductive islands, the electrically conductivereflector, and the positive and negative electrically conductive padsmay define a reflective area on the packaging substrate surrounding theplurality of light emitting diodes, and the electrically conductivereflector may be electrically isolated from each of the positiveelectrically conductive pad, the negative electrically conductive pad,and each of the plurality of electrically conductive islands.

At least two light emitting diodes of the plurality of light emittingdiodes may be electrically coupled in parallel between the positive andnegative electrically conductive pads, and/or at least two strings ofthe plurality of light emitting diodes may be electrically coupled inparallel between the positive and negative electrically conductive pads.At least one of the light emitting diodes may include an anode contactelectrically and mechanically coupled to the packaging substrate using afirst metallic bond physically located between the anode contact and thepackaging substrate and a cathode contact electrically and mechanicallycoupled to the packaging substrate using a second metallic bondphysically located between the cathode contact and the packagingsubstrate.

Each of the plurality of light emitting diodes may include a dioderegion having first and second opposing faces including therein ann-type layer and a p-type layer, an anode contact that ohmicallycontacts the p-type layer and extends on the first face, a cathodecontact that ohmically contacts the n-type layer and extends on thefirst face, and a support substrate on the second face of the dioderegion. Moreover, the diode region may be between the support substrateand the anode and cathode contacts, and the support substrate may have athickness of at least about 50 micrometers.

In addition, a continuous optical coating may be provided on theplurality of light emitting diodes. The continuous optical coating mayinclude a layer of a transparent and/or translucent material including aphosphor material therein, and a thickness of the continuous opticalcoating relative to the packaging face of the packaging substrate may begreater than a thickness of each of the plurality of light emittingdiodes relative to the packaging face of the packaging substrate. Asurface of the continuous optical coating opposite the packagingsubstrate may be substantially planar over an area including theplurality of light emitting diodes. Moreover, a dam may surround theplurality of light emitting diodes, with the continuous optical coatingbeing confined within the dam.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are cross-sectional views of LEDs and packaged LEDsaccording to various embodiments described herein.

FIGS. 3A, 3B, and 3C are a top view, a cross-sectional view, and abottom view, respectively, of an LED according to embodiments of FIG. 1or 1

FIGS. 4 and 5 illustrate geometries of substrates of FIGS. 1-3,according to various embodiments described herein.

FIG. 6A is a photograph of a submount with an LED mounted thereonaccording to various embodiments of FIGS. 1-4.

FIG. 6B is a photograph of a packaged LED according to variousembodiments of FIGS. 1-4.

FIGS. 7A and 7B are respective plan and cross-sectional views of anarray of packaged LED die electrically coupled in parallel on a submountaccording to various embodiments described herein.

FIGS. 8A and 8B are respective plan and cross-sectional views of anarray of packaged LED die electrically coupled in parallel on a submountincluding interdigitated cathode and anode pads according to variousembodiments described herein.

FIGS. 9A and 9B are respective plan and cross-sectional views of anarray of radially arranged LED die electrically coupled in parallel on asubmount according to various embodiments described herein.

FIGS. 10A and 10B are respective plan and cross-sectional views of anarray of packaged LED die electrically coupled in parallel on a submountincluding interdigitated electrodes according to various embodimentsdescribed herein.

FIG. 11A is a plan view of a submount including cathode and anode padsfor an array of LED die according to various embodiments describedherein.

FIG. 11B is a plan view of an array of LED die electrically coupled inparallel on the submount of FIG. 11B.

FIG. 12A is a plan view of a submount including interdigitated cathodeand anode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 12B is a plan view of an array of LED die electrically coupled inparallel on the submount of FIG. 12B.

FIG. 12C is a cross-sectional view of a column of LED die from the arrayof FIG. 12B.

FIG. 13A is a plan view of a submount including interdigitated cathodeand anode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 13B is a plan view of an array of LED die electrically coupled inparallel on the submount of FIG. 13A.

FIG. 14A is a plan view of a submount including cathode, island, andanode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 14B is a plan view of an array of LED die electrically coupled inseries on the submount of FIG. 14B.

FIG. 14C is a cross-sectional view of a column of LED die from the arrayof FIG. 14B.

FIG. 15A is a plan view of a submount including cathode, island, andanode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 15B is a plan view of an array of LED die electrically coupled inseries on the submount of FIG. 15B.

FIG. 16A is a plan view of a submount including cathode, island, andanode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 16B is a plan view of an array of LED die with offset rowselectrically coupled in series on the submount of FIG. 16B.

FIG. 17A is a plan view of a submount including cathode, island, andanode pads for an array of LED die according to various embodimentsdescribed herein.

FIG. 17B is a plan view of an array of LED die with aligned rows andcolumns electrically coupled in series on the submount of FIG. 17B.

FIG. 18 is a cross-sectional view of an array of LED die with acontinuous and conformal phosphor layer according to various embodimentsdescribed herein.

FIG. 19 is a cross-sectional view of an array of LED die with a 1according to various embodiments described herein.

FIG. 20 is a cross-sectional view of an array of LED die with a damcontaining a phosphor layer on the array according to variousembodiments described herein.

FIG. 21A is a photograph of a LED assembly including 16 LED die with acommon encapsulating lens on a submount according to various embodimentsdescribed herein, and FIG. 21B is a photograph of the assembly of FIG.21A without the encapsulating lens.

FIG. 22A is a photograph of a submount including electrically conductivepads for an array of serially connected LED die according to variousembodiments described herein, and FIGS. 22B, 22C, and 22D arephotographs of LED assemblies including the submount of FIG. 22A.

FIGS. 23A, 23B, and 23C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments describedherein.

FIG. 23D is a enlarged cross sectional view of the submount of FIGS.23A, 23B, and 23C illustrating dimensions of top side and bottom sidemetallizations according to embodiments described herein.

FIG. 23E is a table providing a legend of materials and dimensions ofFIGS. 23A-23D according to embodiments described herein.

FIG. 24 is an enlarged top view of the submount of FIGS. 23A-23Epopulated with 75 serially connected LEDs according to embodimentsdescribed herein.

FIG. 25 is a photograph illustrating an array of submounts according toFIGS. 23A-23E populated with LEDs according to FIG. 24.

FIG. 26 is a photograph illustrating a submount populated with LEDsaccording to FIG. 24 with a lens thereon according to FIG. 19 (without aphosphor layer).

FIG. 27 is a photograph illustrating a an array of submounts accordingto FIGS. 23A-23E populated with LEDs according to FIG. 24 with aphosphor layer thereon according to FIG. 19.

FIG. 28 is a photograph illustrating a submount populated with LEDsaccording to FIG. 24 with a phosphor layer and lens thereon according toFIG. 19.

FIGS. 29A, 29B, and 29C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments describedherein.

FIG. 29D is a enlarged cross sectional view of the submount of FIGS.29A, 29B, and 29C illustrating dimensions of top side and bottom sidemetallizations according to embodiments described herein.

FIG. 29E is a table providing a legend of materials and dimensions ofFIGS. 29A-29D according to embodiments described herein.

FIG. 30A is an enlarged top view of the submount of FIGS. 29A-29Eaccording to embodiments described herein.

FIG. 30B illustrates the submount of FIGS. 29A-29E populated with 6strings of 12 serially connected LEDs according to embodiments describedherein.

FIG. 30C is a greatly enlarged view of a central portion of the submountof FIG. 30A populated with LEDs according to embodiments describedherein.

FIGS. 31A, 31B, and 31C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments describedherein.

FIG. 31D is a enlarged cross sectional view of the submount of FIGS.31A, 31B, and 31C illustrating dimensions of top side and bottom sidemetallizations according to embodiments described herein.

FIG. 31E is a table providing a legend of materials and dimensions ofFIGS. 31A-31D according to embodiments described herein.

FIG. 32A is an enlarged top view of the submount of FIGS. 31A-31Eaccording to embodiments described herein.

FIG. 32B illustrates the submount of FIGS. 31A-31E populated 72 LEDsaccording to embodiments described herein.

FIG. 32C is a greatly enlarged view of a central portion of the submountof FIG. 32A populated with 72 LEDs according to embodiments describedherein.

FIGS. 33A, 33B, and 33C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments describedherein.

FIG. 33D is a enlarged cross sectional view of the submount of FIGS.33A, 33B, and 33C illustrating dimensions of top side and bottom sidemetallizations according to embodiments described herein.

FIG. 33E is a table providing a legend of materials and dimensions ofFIGS. 33A-33D according to embodiments described herein.

FIG. 34A is an enlarged top view of the submount of FIGS. 33A-33Eaccording to embodiments described herein.

FIG. 34B illustrates the submount of FIGS. 33A-33E populated with 108LEDs according to embodiments described herein.

FIG. 34C is a greatly enlarged view of a central portion of the submountof FIG. 34A populated with 108 LEDs according to embodiments describedherein.

FIG. 35 is a schematic diagram illustrating electrical couplings of LEDsLa1 to La36 and Lb1 to Lb36 of the device of FIGS. 31A-31D and 32A-32Caccording to embodiments described herein.

FIG. 36A is a schematic diagram illustrating electrical couplings ofLEDs La1 to La12, Lb1 to Lb12, Lc1 to Lc12, Ld1 to Ld12, Le1 to Le12,and Lf1 to Lf12 of the device of FIGS. 29A-29E and 30A-30C according toembodiments described herein.

FIGS. 36B, 36C, and 36D are schematic diagrams illustrating alternativeelectrical couplings of LEDs of FIGS. 29A-29E and 30A-30C according toembodiments described herein.

DETAILED DESCRIPTION

The present invention now will be described more fully with reference tothe accompanying drawings, in which various embodiments are shown. Thisinvention may, however, be embodied in many different forms and shouldnot be construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the size and relative sizes oflayers and regions may be exaggerated for clarity. Like numbers refer tolike elements throughout.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may also bepresent. Furthermore, relative terms such as “beneath” or “overlies” maybe used herein to describe a relationship of one layer or region toanother layer or region relative to a substrate or base layer asillustrated in the figures. It will be understood that these terms areintended to encompass different orientations of the device in additionto the orientation depicted in the figures. Finally, the term “directly”means that there are no intervening elements. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items and may be abbreviated as “/”.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Embodiments of the invention are described herein with reference tocross-sectional and/or other illustrations that are schematicillustrations of idealized embodiments of the invention. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as arectangle will, typically, have rounded or curved features due to normalmanufacturing tolerances. Thus, the regions illustrated in the figuresare schematic in nature and their shapes are not intended to illustratethe precise shape of a region of a device and are not intended to limitthe scope of the invention, unless otherwise defined herein.

Unless otherwise defined herein, all terms (including technical andscientific terms) used herein have the same meaning as commonlyunderstood by one of ordinary skill in the art to which this inventionbelongs. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand this specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

As used herein, a layer or region of an LED is considered to be“transparent” when at least 90% of the radiation from the LED thatimpinges on the transparent layer or region emerges through thetransparent region. For example, in the context of blue and/or greenLEDs that are fabricated from gallium nitride-based materials, silicondioxide can provide a transparent insulating layer (for example, atleast 90% transparent), whereas indium tin oxide (ITO) can provide atransparent conductive layer (for example, at least 90% transparent) asmeasured by considering transmitted and reflected components on asapphire substrate. Moreover, as used herein, a layer or region of anLED is considered to be “reflective” when at least 90% of the angleaveraged radiation that impinges on the reflective layer or region fromthe LED is reflected back into the LED. For example, in the context ofgallium nitride-based blue and/or green LEDs, silver (for example, atleast 90% reflective) may be considered reflective materials. In thecase of ultraviolet (UV) LEDs, appropriate materials may be selected toprovide a desired, and in some embodiments high, reflectivity and/or adesired, and in some embodiments low, absorption.

Some embodiments now will be described generally with reference togallium nitride (GaN)-based light emitting diodes on silicon carbide(SiC)-based growth substrates for ease of understanding the descriptionherein. However, it will be understood by those having skill in the artthat other embodiments of the present invention may be based on avariety of different combinations of growth substrate and epitaxiallayers. For example, combinations can include AlGaInP diodes on GaPgrowth substrates; InGaAs diodes on GaAs growth substrates; AlGaAsdiodes on GaAs growth substrates; SiC diodes on SiC or sapphire (Al₂O₃)growth substrates and/or a Group III-nitride-based diode on galliumnitride, silicon carbide, aluminum nitride, sapphire, zinc oxide and/orother growth substrates. Moreover, in other embodiments, a growthsubstrate may not be present in the finished product. For example, thegrowth substrate may be removed after forming the light emitting diode,and/or a bonded substrate may be provided on the light emitting diodeafter removing the growth substrate. In some embodiments, the lightemitting diodes may be gallium nitride-based LED devices manufacturedand sold by Cree, Inc. of Durham, N.C.

It is known to provide a conformal phosphor layer on an oblique ortapered sidewall of a light emitting diode, as described in U.S. Pat.No. 6,853,010, to Slater, Jr. et al., entitled Phosphor-Coated LightEmitting Diodes Including Tapered Sidewalls, and Fabrication MethodsTherefor, assigned to the assignee of the present application, theentire disclosure of which is hereby incorporated by reference herein asif set forth fully herein (hereinafter referred to as “the '010patent”). As described in the '010 patent, the tapered or obliquesidewall can allow at least some of the emitting surfaces of a lightemitting diode (LED) to be covered with a nearly conformalphosphor-containing layer of substantially uniform thickness. This moreconformal coverage can produce a desired spectrum of light, while alsoallowing more radiant flux to be emitted from the phosphor-coated LED.Phosphor layers are further discussed detail in U.S. application Ser.No. 13/018,013 to Donofrio et al., entitled Horizontal Light EmittingDiodes Including Phosphor Particles, and in U.S. application Ser. No.13/017,845 to Donofrio et al., entitled Conformally Coated LightEmitting Devices And Methods For Providing The Same, both filed Jan. 31,2011, and assigned to the assignee of the present application. Thedisclosures of both of the above referenced applications are herebyincorporated herein by reference in their entireties as if set forthfully herein.

Various embodiments described herein may arise from recognition that aconformal phosphor layer on an oblique sidewall of an LED may providefurther unanticipated advantages. Specifically, larger particle sizephosphor particles may be used in the conformal layer that comprisesphosphor. It is well known that larger phosphor particles are generallymore efficient in light conversion than small sized phosphor particles.Unfortunately, due to their large size, large phosphor particles mayalso have a lower light scattering efficiency than relatively smallphosphor particles. The low scattering efficiency may produce a highangular variation in Correlated Color Temperature (CCT), which istypical in white LEDs using large particulate size phosphor particlesfor brightness boost.

In sharp contrast, various embodiments described herein may providerelatively high brightness with relatively low angular variation, byproviding a conformal layer that comprises large phosphor particles onthe outer face and on the oblique sidewall of an LED.

It will be understood that real world phosphor particle layers are notprecisely uniform in size. Rather, consistent with other particulatematerials, a range of particle sizes may be provided, and variousmetrics are used to indicate a measure of particle size in a particulatematerial. Particle size is generally measured by an equivalent particlediameter, which may take into account the fact that the particles may benon-spherical. Moreover, the particle size distribution may be specifiedby providing one or more equivalent particle diameters, oftenabbreviated with “d”, to indicate a mass percent of the particles thathas a smaller diameter. Thus, d50, also referred to as an averageequivalent particle diameter, indicates that 50 mass-% of the particleshas a smaller diameter. Moreover, an equivalent particle diameter d10refers to 10 mass-% of the particles having a smaller diameter, whereasan equivalent particle diameter d90 refers to 90 mass-% of the particleshaving a smaller diameter. A given phosphor may be specified in terms ofd50, d10 and/or d90. Moreover, other metrics other than d50, d10 and d90may be used, such as d75 and d25. Combinations of these metrics also maybe used.

FIG. 1 is a cross-sectional view of a light emitting diode (alsoreferred to as a light emitting diode “die” or “chip”) and a packagedlight emitting diode according to various embodiments described herein.Referring to FIG. 1, these light emitting diodes 100 include a dioderegion 110 having first and second opposing faces 110 a, 110 b,respectively, and including therein an n-type layer 112 and a p-typelayer 114. Other layers or regions may be provided, which may includequantum wells, buffer layers, etc., that need not be described herein.An anode contact 160 ohmically contacts the p-type layer 114 and extendson a first face 110 a. The anode contact 160 may directly ohmicallycontact the p-type layer 114, or may ohmically contact the p-type layer114 by way of one or more conductive vias 162 and/or other intermediatelayers. A cathode contact 170 ohmically contacts the n-type layer 112and also extends on the first face 110 a. The cathode contact maydirectly ohmically contact the n-type layer 112, or may ohmicallycontact the n-type layer 112 by way of one or more conductive vias 172and/or other intermediate layers. As illustrated in FIG. 1, the anodecontact 160 and the cathode contact 170 that both extend on the firstface 110 a are coplanar. The diode region 110 also may be referred toherein as an “LED epi region”, because it is typically formedepitaxially on a substrate 120. For example, a Group III-nitride basedLED epi 110 may be formed on a silicon carbide growth substrate. In someembodiments, as will be described below, the growth substrate may bepresent in the finished product. In other embodiments, the growthsubstrate may be removed. In still other embodiments, another substratemay be provided that is different from the growth substrate, and theother substrate may be bonded to the LED after removing the growthsubstrate.

As also shown in FIG. 1, a transparent substrate 120, such as atransparent silicon carbide growth substrate or a transparent sapphiregrowth substrate, is included on the second face 110 b of the dioderegion 110. The transparent substrate 120 includes a sidewall 120 a andmay also include an inner face 120 c adjacent the second face 110 b ofthe diode region 110 and an outer face 120 b, remote from the inner face120 c. The outer face 120 b is of smaller area than the inner face 120c. In some embodiments, the sidewall 120 a may be stepped, beveledand/or faceted, so as to provide the outer face 120 b that is of smallerarea than the inner face 120 c. In other embodiments, as shown in FIG.1, the sidewall is an oblique sidewall 120 a that extends at an obliqueangle θ, and in some embodiments at an obtuse angle, from the outer face120 b towards the inner face 120 c. According to some embodiments,transparent substrate 120 may have a thickness of at least about 50micrometers, at least about 100 micrometers, or even at least about 150micrometers. Transparent substrate 120, for example, may have athickness in the range of about 150 micrometers to about 400micrometers, or in the range of about 175 micrometers to about 35micrometers. Phosphor layer 140 may thus be separated from portions ofdiode region 110 by a thickness of transparent substrate 120.

LEDs 100 configured as was described above in connection with FIG. 1,may be referred to as “horizontal” or “lateral” LEDs, because both theanode and the cathode contacts thereof are provided on a single face ofthe LED. Horizontal LEDs may be contrasted with vertical LEDs in whichthe anode and cathode contacts are provided on opposite faces thereof,as is illustrated, for example, in the '010 patent.

Various other configurations of horizontal LEDs that may be usedaccording to any of the embodiments described herein, are described indetail in U.S. Patent Application publication 2009/0283787 to Donofrioet al., entitled Semiconductor Light Emitting Diodes Having ReflectiveStructures and Methods of Fabricating Same, assigned to the assignee ofthe present application, the disclosure of which is hereby incorporatedherein by reference in its entirety as if set forth fully herein(hereinafter referred to as “the '787 Publication”).

Still continuing with the description of FIG. 1, a conformal layer 140that comprises phosphor particles 142 having an average equivalentparticle diameter d50 of at least 10 μm, is provided on the outer face120 b and on the oblique sidewall 120 a. In embodiments of FIG. 1, theentire outer face 120 b and the entire oblique sidewall 120 a arecovered with the phosphor layer 140. However, in other embodiments, theentire outer face 120 b and/or the entire oblique sidewall 120 a neednot be covered with the phosphor layer 140. Moreover, the conformalphosphor layer 140 may be of uniform thickness on the outer face 120 band on the oblique sidewall 120 a. In some embodiments, this uniformthickness is between the range of between about 36 μm and about 56 μmand, in other embodiments, a range of between about 30 μm and about 75μm may be provided. In other embodiments, a thickness of about 46 μm maybe provided.

Various embodiments of phosphor layers 140 and diode regions 110 may beprovided according to various embodiments described herein. For example,in some embodiments, the diode region 110 is configured to emit bluelight, for example light having a dominant wavelength of about 450-460nm, and the conformal layer comprises yellow phosphor, such as YAG:Cephosphor having a peak wavelength of about 550 nm and an averageequivalent particle diameter d50 of at least 10 μm. In otherembodiments, an average equivalent diameter d50 of at about 15 μm isprovided. In still other embodiments, an average equivalent diameter d50of between about 15 μm and about 17 μm is provided.

In other embodiments, the diode region 110 is configured to emit bluelight upon energization thereof, as described above, and the conformallayer 140 may comprise a mixture of phosphor having average equivalentparticle diameter of at least about 10 μm, as described above, and redphosphor, such as a CASN-based phosphor, having an average equivalentparticle diameter d50 of about 10 μm in size. In still otherembodiments, the mixture of yellow phosphor and red phosphor may have aphosphor weight ratio of the yellow phosphor to the red phosphor of atleast about 5:1 and, in other embodiments, at least about 9:1. In someembodiments, since at least five times as much yellow phosphor as redphosphor is provided, a wider range of red phosphor particle sizes maybe used in combination with yellow phosphor particles having an averageequivalent particle diameter d50 of at least about 10 μm.

As was described above, various embodiments of FIG. 1 may arise fromrecognition that a conformal phosphor layer 140 on an oblique sidewall120 a of an LED 100 may provide further unanticipated advantages.Specifically, large particle size phosphor particles 142 may be used inthe conformal layer 140 that comprises phosphor. It is well known thatlarger phosphor particles 142 are generally more efficient in lightconversion than small sized phosphor particles. Unfortunately, due totheir large size, large phosphor particles 142 may also have a lowerlight scattering efficiency than relatively small phosphor particles.The low scattering efficiency may produce a high angular variation inCCT, which is typical in white LEDs using large particulate sizephosphor particles for brightness boost.

In sharp contrast, various embodiments described herein may providerelatively high brightness with relatively low angular variation, byproviding a conformal layer 140 that comprises large phosphor particles142 on the outer face 120 b and on the oblique sidewall 120 a of an LED.

Moreover, various embodiments described herein may provide otherunexpected advantages. Specifically, since the CCT variation can bereduced compared to an LED with a non-oblique sidewall, less redphosphor may need to be used. For example, with non-oblique walls, aratio of yellow phosphor to red phosphor may be about 2:1 whereas, asdescribed above, ratios of at least about 5:1 or at least about 9:1 maybe used. Since red phosphor often is more expensive than yellowphosphor, lower cost LEDs may be obtained. Moreover, since a higherratio of yellow phosphor to red phosphor may be used, the particle sizeof the red phosphor may vary over a wide range because the particle sizeof the yellow phosphor will dominate.

Continuing with the description of FIG. 1, the LED 100 may be combinedwith a packaging substrate, such as a submount 180, and a lens 190 toprovide a packaged LED 200. The submount 180 may include a body 182 thatmay comprise aluminum nitride (AlN). In other embodiments, metal coresubstrates, printed circuit boards, lead frames and/or otherconventional packaging substrates may be used to mount the LED 100 in aflip-chip configuration. The submount 180 includes a submount face 182a, and an anode pad 184 and a cathode pad 186 thereon. The anode andcathode pads may comprise silver-plated copper and/or other conductivematerials. As illustrated in FIG. 1, the LED 100 is mounted on thesubmount 180, such that the first face 110 a is adjacent the submountface 182 a, the outer face 110 b is remote from the submount 180, theanode contact 184 is adjacent the anode pad 160, and the cathode contact186 is adjacent the cathode pad 170. In some embodiments, a bondinglayer, such as a eutectic gold/tin solder layer 188, is used toelectrically, thermally and mechanically connect the anode contact 160to the anode pad 184, and the cathode contact 170 to the cathode pad186. In other embodiments, direct attachment of the anode contact 160 tothe anode pad 184, and direct attachment of the cathode contact 170 tothe cathode pad 186 may be provided, for example using thermocompressionbonding and/or other techniques.

A packaged device anode 192 and a packaged device cathode 194 may beprovided on a second face 182 b of the submount body 182, and may beconnected to the anode pad 184 and cathode pad 186, respectively, usinginternal vias and/or conductive layers that extend on and/or around thesubmount body 182.

Various embodiments of submounts 180 that may be used with embodimentsdescribed herein, are described in the '787 Publication that was citedabove. Various other embodiments of submounts 180 are described in U.S.Patent Application Publication 2009/0108281 to Keller et al., entitledLight Emitting Diode Package and Method for Fabricating Same, assignedto the assignee of the present application, the disclosure of which ishereby incorporated herein by reference in its entirety as if set forthfully herein (hereinafter referred to as “the '281 Publication”). Itwill be understood that any and all embodiments of these submounts maybe used in embodiments of FIG. 1. However, the pad structure on thesubmount may be modified so as to be used with a horizontal LED 100 ofFIG. 1, rather than the vertical LEDs described in the '281 Publication.

Finally, the packaged LED 200 may also include a lens 190 that extendsfrom submount face 180 a to surround the LED 100. The lens 190 may be amolded plastic lens, as described in detail in the '281 Publication, andmay be fabricated on the submount according to techniques that aredescribed in the '281 Publication, and/or other techniques. In someembodiments, the lens may be about 3.06 mm in diameter.

FIG. 2 is a cross-sectional view of LEDs and packaged LEDs according tovarious other embodiments. Compared to embodiments of FIG. 1, thephosphor layer 140′ extends across the diode region 110 and/or on thefirst face 182 of the submount body 182. The phosphor layer may befabricated to extend onto the submount as is described in the '281Publication. Moreover, as shown in FIG. 2, the submount 180 may includea layer 194 on the first face 182 a thereof. The layer 194 may be anextension of the anode pad 184 and the cathode pad 186 or may bedistinct therefrom. In some embodiments, the layer 194 is a reflectivelayer that extends between the submount face 182 a and the conformallayer 140′ that includes phosphor that extends on the submount face 182a. This reflective layer 194 can reflect light that passes through thephosphor layer that is on the submount face 182 a back toward the lens190, and can thereby increase efficiency of the LED.

Packaged LEDs as described above in connection with FIGS. 1 and 2 may beembodied as a Cree® XLamp® XP-E High-Efficiency White (HEW) LED, asdescribed, for example, in the Cree® XLamp® XP-E High-Efficiency WhiteLEDs Data Sheet, Publication No. CLD-DS34, Rev. 0, dated Dec. 6, 2010,and available at cree.com/products/xlamp_xpe.asp, the disclosure ofwhich is hereby incorporated herein by reference in its entirety as ifset forth fully herein.

FIGS. 3A, 3B and 3C are a top view, a cross-section and a bottom view,respectively, of an LED 100 of FIG. 1 or 2. The phosphor layer 140/140′is not illustrated.

In FIGS. 1 and 2, the outer face 120 b was planar. However, inembodiments of FIG. 3A, the outer face 120 b′ includes at least onegroove, such as an X-shaped groove 310 therein. Multiple X-shapedgrooves and/or other shaped grooves may also be provided. Moreover, asshown in FIG. 3C, in some embodiments, the anode contact 160 and thecathode contact 170 may collectively occupy at least about 90% of theactive diode region area.

Specifically, FIGS. 3A-3C illustrate an embodiment wherein the innerface 120 c of the substrate 120 is a square inner face 120 c havingsides that are about 1,000 μm long, the outer face 120 b′ is a squareouter face having sides that are about 642 μm long, and a thickness ordistance t between the square inner and outer faces (also referred to as“height”) is about 335 μm, so as to define an area ratio between theouter face 120 b and the inner face 120 c of about 0.41. The dioderegion 110 may also be a square, having sides that are about 1,000 μmlong. A small gap 320 of about 75 μm (micrometers) is provided. Acalculation of the active attach area may be made as follows:

Total active area of diode region=751,275 μm²(cathode)+70,875μm²(gap)+70,875 μm²(anode)=893,025 μm².

Total active attach area=751,275 μm²(cathode)+70,875 μm²(anode)=822,150μm².

Thus, the active attach area is at least about 90% of the active dioderegion area.

According to some embodiments, a total attach area (i.e., a combinedsurface area of anode contact 160 and cathode contact 170) may begreater than 70% of a total surface area of face 110 a of the LED,greater than 80% of the total surface area of face 110 a, or evengreater than 90% of the total surface area of face 110 a. As shown inFIGS. 3A to 3C, for example, face 110 a of the LED may have a surfacearea of 1×10⁶ μm², anode contact 160 may have a contact surface area of70,875 μm², and cathode contact 170 may have a contact surface area of751,275 μm². Accordingly, anode contact 160 and cathode contact 170 maycollectively occupy about 82% of the surface area of face 110 a of theLED.

Surface areas of anode and cathode contacts 160 and 170 may beasymmetric, with cathode 170 accounting for at least 70% of the combinedcontact area, at least 80% of the combined contact area, or even atleast 90% of the combined contact area. As shown in FIGS. 3A to 3C, forexample, cathode contact 170 may occupy about 91% of the total contactarea (i.e., 100%×751,275 μm²/(751,275 μm²+70,875 μm²)) or about 75% ofthe surface area of face 110 a (i.e., 100%×751,275 μm²/(1×10⁶ μm²)) ofthe LED. As further shown in FIGS. 3A to 3C, for example, anode contact160 may occupy about 9% of the total contact area (i.e., 100%×70,875μm²/(751,275 μm²+70,875 μm²)), or about 7% of the surface area of face110 a (i.e., 100%×70,875 μm²/1×10⁶ μm²) of the LED. Accordingly, LED 100may asymmetrically bridge anode and cathode pads 184 and 186 of submount180 as shown in FIGS. 1 and 2.

As further shown in FIGS. 3A to 3C, widths of anode and cathode contacts160 and 170 may be at least 60% of a width of face 110 a of the LED, atleast 70% of a width of face 110 a of the LED, or even at least 90% of awidth of face 110 a of the LED. For example, each of anode and cathodecontacts 160 and 170 may have a width of about 945 μm, and LED face 110Amay have a width of 1,000 μm (taken in a same direction as the widths ofanode and cathode contacts 160 and 170). Accordingly, each of anode andcathode contacts 160 and 170 of FIG. 3C may have a width that is about95% of a width of LED face 110 a.

Table 1 illustrates various configuration geometries of the substrate120 that may be provided according to various other embodiments. It willbe understood that the “area ratios” used herein are based on thedimensions of the sides of the faces and do not include any addedsurface area due to texturing, grooves and/or other light extractionfeatures.

TABLE 1 Base (Inner) Top (Outer) Area Ratio Aspect Ratio DesignatorArea, μm² Area, μm² (Top/Base) (Height/Base) DA1000 1,000,000 412,1640.412164 0.335 DA850 722,500 242,064 0.335036678 0.394 DA700 490,000116,964 0.238702041 0.5

FIG. 4 illustrates these embodiments. Specifically, the top row of Table1 illustrates various embodiments wherein the inner face 120 c is asquare inner face having sides that are about 1,000 μm (micrometer) long(total area 1,000,000 μm²), the outer face 120 b is a square outer facehaving sides that are about 642 μm long (total area 412,164 μm²) and adistance (height) between the square inner and outer faces is about 335μm so as to define an area ratio of the outer face to the inner face(top to base) of about 0.41, and an aspect ratio of height to a side ofthe inner face (base) of about 0.335. These embodiments are alsoillustrated in FIG. 3B. The second row of Table 1 illustratesembodiments wherein the inner face 120 c is a square inner face havingsides that are about 850 μm long (total area 722,500 μm²), the outerface 120 b is a square outer face having sides that are about 492 μmlong (total area 242,064 μm²) and a distance (height) between the squareinner and outer faces is about 335 μm so as to define an area ratio ofthe outer face to the inner face of about 0.33 and an aspect ratio ofheight to base of about 0.39. Finally, the third row of Table 1illustrates various embodiments wherein the inner face 120 c is a squareinner face having sides that are about 700 μm long (total area about72,2500 μm²), the outer face 120 b is a square outer face having sidesthat are about 342 μm long (total area about 116,964 μm²) and a distanceheight between the square inner and outer faces is about 335 μm so as todefine an area ratio of the outer face to the inner face of about 0.24and an aspect ratio of height to base of about 0.5.

FIG. 5 and Table 2 illustrate other embodiments wherein the inner face120 c is a rectangular inner face of size 350 μm×470 μm. In the firstline of Table 2, the height is about 175 μm thick, and the outer face120 b is a rectangle of size 177 μm×297 μm, so as to provide a base(inner) area of 164,500 μm² and a top (outer) area of 52,569 μm. Thearea ratio of top to base is about 0.32, and the ratio of height to baseis about 0.5. The second line of Table 2 illustrates a thicker height ofabout 290 μm, so that the top has sides of about 44 μm×164 μm, leadingto an area ratio of about 0.044 and a ratio of height to base of about0.8.

TABLE 2 Base (Inner) Top (Outer) Area Ratio Aspect Ratio DesignatorArea, μm² Area, μm² (Top/Base) (Height/Base) DA350- 164,500 52,5690.319568389 0.5 Standard 175 μm thick DA350 164,500 7,216 0.0438662610.828 Extreme- 290 μm thick

Accordingly, embodiments of Table 1 and Table 2, corresponding to FIGS.4 and 5, can provide light emitting diodes wherein an area ratio of theouter face to the inner face is less than or about 0.4 and, in some ofthese embodiments, the aspect ratio of the height to a side of the innerface is at least about 0.3. These tables and figures also illustrateother embodiments wherein the area ratio of the outer face to the innerface is less than or about 0.33 and, in some embodiments, the aspectratio of the height to a side of the inner face is at least about 0.4.These tables and figures also illustrate yet other embodiments whereinthe area ratio of the outer face to the inner face is less than or about0.04 and, in some embodiments, the height to base aspect ratio is atleast about 0.8.

It has been found that light extraction may be improved as the ratio ofthe outer area to the inner area is reduced. The larger area devices,such as the DA1000 described on the first line of Table 1 can provideadditional extraction by providing a groove, as was illustrated in FIG.3A. This would appear to indicate that further extraction benefit wouldbe obtained by a further reduction in the ratio of the top to base, butthis may be expensive due to the blade width that may be needed forbeveling the sidewalls. On the smaller devices, such as the DA350described in the first row of Table 2, there may be no further gain atblue light in further increasing the ratio, so that an aspect ratio ofabout 0.32 may already be sufficient for maximum blue extraction.

Lateral LED configurations as were described in Tables 1 and 2 can allowfor very low ratios of top to base (outer to inner surfaces of thesubstrate) compared to previous generation vertical chips, since thebackside (top) contact area need not be considered for the electricalperformance of the device. Moreover, improved light extraction of thesedevices may also be a factor in conversion efficiency, since thephosphor layers can scatter light back into the chips.

FIG. 6A is a photograph of a submount 180 with an LED 110 mountedthereon, as was described in connection with FIGS. 1-4. FIG. 6B is aphotograph of a packaged LED 200 of FIGS. 1-4 including lens 190.

Various embodiments that were illustrated in FIGS. 1-6 may also beregarded as illustrating a light emitting diode 100 that comprises adiode region 110 having first and second opposing faces 110 a, 110 b andincluding therein an n-type layer 112 and a p-type layer 114. An anodecontact 160 ohmically contacts the p-type layer and extends on the firstface 110 a. A cathode contact 170 ohmically contacts the n-type layer112 and also extends on the first face 110 a. A transparent substrate120 is provided on the second face 110. The transparent substrateincludes an inner face 120 c adjacent the second face 110 b, an outerface 120 b remote from the second face that is of smaller area than theinner face 120 c, and a sidewall 120 a that extends from the outer faceto the inner face. An area ratio of the outer face to the inner face isless than or about 0.4. In some embodiments, the sidewall is a steppedsidewall. In other embodiments, the sidewall comprises an obliquesidewall that extends at an oblique angle from the outer face towardsthe inner face. A conformal layer 140, 140′ that comprises phosphor 142having an average equivalent particle diameter d50 of at least about 10μm is provided on the outer face 120 b and on the sidewall 120 a.

FIGS. 1-6 may also be regarded as describing other embodiments of apackaged light emitting diode die 200 that includes a light emittingdiode die including a diode region, an anode contact and a cathodecontact, as described above. A submount 180 is also provided as wasdescribed above. Moreover, a conformal layer 140, 140′ that comprisesphosphor 142 is spaced apart from the diode region 110 and extendsconformally onto the submount face 182 a away from the light emittingdiode die 110. The conformal layer may be spaced apart from the dioderegion by the transparent substrate 120 and/or by other means, such as adome.

LEDs of FIGS. 1, 2, 3A to 3C, 4, 5, and 6A to 6B may also be provided inarrays on a same packing substrate (e.g., submount) as discussed ingreater detail below. For example, an array of LEDs may be provided withthe LEDs electrically connected in series and/or parallel. Each of theLEDs may have a horizontal structure with anode and cathode contacts ofeach LED provided between the LED and respective pads of the submount.Using direct LED die attach as discussed above, arrays of LED die may beprovided with spacings between LED die of less than about 250micrometers, less than about 100 micrometers, or even less than about 50micrometers.

Some embodiments may provide relatively small area LED submounts for LEDarrays with higher voltages where LED die bonding areas are moreefficiently utilized to balance desired operating voltage and chip areaand balanced with practical aspects of maintaining a chip spacing thatprovides ease of manufacture and less light absorption to provideincreased efficiency and increased light output. Spacings between LEDdie, for example, may be less than about 75 micrometers, less than about60 micrometers, less than about 40 micrometers, and/or in the range ofabout 40 micrometers to about 75 micrometers. Generally, smallerspacings between light emitting diode die may be desired, provided thatsufficient space (e.g., greater than about 10 micrometers, or greaterthan about 20 micrometers) is provided to allow manufacturing placementand/or to reduce light absorption between light emitting diode die.According to some embodiments, spacings between LED die may be in therange of about 20 micrometers to about 500 micrometers, in the range ofabout 40 micrometers to about 150 micrometers, or even in the range ofabout 50 micrometers to about 100 micrometers.

In embodiments discussed below, LED die, submounts, and elements thereofmay be provided as discussed above with respect to FIGS. 1, 2, 3A to 3C,4, 5, and 6A to 6B. For ease of illustration, however, elements may beomitted from the following figures where inclusion of such elementswould be overly repetitious. For example, diode regions 110 may beillustrated below without showing elements thereof (e.g., withoutseparately showing n-type layer 112, p-type layer 114, conductive vias162/172, etc.). Each of diode regions 110 discussed below, however, mayinclude elements discussed above with respect to FIGS. 1 and 2.

FIGS. 7A and 7B illustrate plan and cross-sectional views of an array ofsix LED die 100 a to 100 f electrically coupled in parallel betweenanode and cathode pads 184 and 186 of submount 180. In addition, anelectrostatic discharge (ESD) protection device 194 may be electricallycoupled between anode and cathode pads 184 and 186. As shown, portionsof anode pad 184 may extend between opposing portions of cathode pad186, and LED die 100 a to 100 f may bridge gap 196 between anode andcathode pads 184 and 186. Moreover, all of LED die 100 a to 100 f may beprovided within a circular area of a same lens 190. While each LED die100 a to 100 f is shown with an individual phosphor layer 140 asdiscussed above with respect to FIG. 1, a continuous phosphor layer maybe provided over all of the LED die 100 a to 100 f as discussed abovewith respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 f may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180. Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 f over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 f over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler 192 between anode and cathode pads184 and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40 μm.

In the assembly of FIGS. 7A and 7B, LED die 100 a to 100 f are arrangedin a rectangular array of 2 rows and 3 columns (with each row includinga same number of LED die and with each column including a same number ofLED die). Spacing between adjacent LED die may be about 0.1 mm, and allof the LED die may be provided within a circular perimeter of a lens 190having a diameter of about 2.55 mm. Each LED die may have a width ofabout 0.35 mm and a length of about 0.47 mm, and ESD protection device194 may have a width of about 0.3 mm and a length of about 0.6 mm. Asdiscussed above with respect to FIGS. 3A to 3C, widths of metallic bonds(i.e., solder layers 188) between anode contacts 160 and anode pad 184and between cathode contacts 170 and cathode pad 186 (in the horizontaldirection of FIG. 7A and into the plane of FIG. 7B) may be at least 60%of a width of the LED die (e.g., at least 0.21 mm), at least 70% of awidth of the LED die (e.g., at least 0.25 mm), or even at least 90% of awidth of the LED die (e.g., at least 0.32 mm). By providing relativelylarge surface areas of contact, electrical and thermal resistances maybe reduced. By providing that all of LEDs 100 a to 100 f aresufficiently spaced from a perimeter of lens 190, an efficiency of lighttransmission through lens 190 may be improved. While lens 190 is notshown in the cross-section of FIG. 7B, it will be understood that lens190 may substantially form a hemisphere or hemispherical section onsubmount 180 surrounding all of LED die 100 a to 100 f.

FIGS. 8A and 8B illustrate plan and cross-sectional views of an array ofsix LED die 100 a to 100 f electrically coupled in parallel betweenanode and cathode pads 184 and 186 of submount 180. In addition, anelectrostatic discharge (ESD) protection device 194 may be electricallycoupled between anode and cathode pads 184 and 186. As shown, anode andcathode pads 184 and 186 may be interdigitated, and LED die 100 a to 100f may bridge gap 196 between anode and cathode pads 184 and 186.Moreover, all of the LED die 100 a to 100 f may be provided within acircular area of a same lens 190. While each LED die 100 a to 100 f isshown with an individual phosphor layer 140 as discussed above withrespect to FIG. 1, a continuous phosphor layer may be provided over allof LED die 100 a to 100 f as discussed above with respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 f may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180. Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 f over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 f over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler 192 between anode and cathode pads184 and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40 μm.

In the assembly of FIGS. 8A and 8B, LED die 100 a to 100 f are arrangedin a rectangular array of 2 rows and 3 columns. Dimensions of LED dieand spacings therebetween may be the same as discussed above withrespect to the structure of FIGS. 7A and 7B. In contrast to thestructure of FIGS. 7A and 7B, however, LED die 100 a to 100 f of bothrows of FIGS. 8A and 8B may be aligned such that anode contacts 160 ofboth rows are oriented toward a first side of submount 180 and cathodecontacts 170 of both rows are oriented toward a second side of submountopposite the first side. While lens 190 is not shown in thecross-section of FIG. 8B, it will be understood that lens 190 maysubstantially form a hemisphere on submount 180 surrounding all of LEDdie 100 a to 100 f.

FIGS. 9A and 9B illustrate plan and cross-sectional views of asubstantially circular array of seven LED die 100 a to 100 gelectrically coupled in parallel between anode and cathode pads 184 and186 of submount 180. In addition, an electrostatic discharge (ESD)protection device 194 may be electrically coupled between anode andcathode pads 184 and 186. As shown, all of LED die 100 a to 100 g may beprovided within a circular area of a same lens 190. Moreover, each ofthe LED die 100 a to 100 g may share a same spacing relative to aperimeter of lens 190, and each of LED die 100 a to 100 g may beoriented radially relative to center of the circular array and/orrelative to a center of lens 190. By providing that LED die 100 a to 100g of the circular array are spaced symmetrically relative to theperimeter of lens 190, a more uniform and/or efficient light output maybe provided through lens 190. As before, LED die 100 a to 100 g maybridge gap 196 between anode and cathode pads 184 and 186. While eachLED die 100 a to 100 g is shown with an individual phosphor layer 140 asdiscussed above with respect to FIG. 1, a continuous phosphor layer maybe provided over all of the LED die 100 a to 100 g as discussed abovewith respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 g may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180. Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 g over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 g over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler 192 between anode and cathode pads184 and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40μ.

In the assembly of FIGS. 9A and 9B, each LED die may have a width ofabout 0.35 mm and a length of about 0.47 mm, and ESD protection device194 may have a width of about 0.3 mm and a length of about 0.6 mm. Asdiscussed above with respect to FIGS. 3A to 3C, widths of metallic bonds(i.e., solder layers 188) between anode contacts 160 and anode pad 184and between cathode contacts 170 and cathode pad 186 (into the plane ofFIG. 9B) may be at least 60% of a width of the LED die (e.g., at least0.21 mm), at least 70% of a width of the LED die (e.g., at least 0.25mm), or even at least 90% of a width of the LED die (e.g., at least 0.32mm). By providing relatively large surface areas of contact, electricaland thermal resistances may be reduced. By providing that all of LEDs100 a to 100 g are sufficiently spaced from a perimeter of lens 190, anefficiency of light transmission through lens 190 may be improved. Whilelens 190 is not shown in the cross-section of FIG. 9B, it will beunderstood that lens 190 may substantially form a hemisphere on submount180 surrounding all of LED die 100 a to 100 g.

FIGS. 10A and 10B illustrate plan and cross-sectional views of asubstantially circular array of seven LED die 100 a to 100 felectrically coupled in parallel between anode and cathode pads 184 and186 of submount 180. In addition, an electrostatic discharge (ESD)protection device 194 may be electrically coupled between anode andcathode pads 184 and 186 via respective metallic bonds 188. ESDprotection device 194 may include contacts 195 electrically andmechanically coupled to anode and cathode pads 184 and 186. As shown,all of LED die 100 a to 100 f may be provided within a circular area ofa same lens 190. Moreover, each of the LED die 100 a to 100 f may sharesubstantially a same spacing relative to a perimeter of lens 190. Incontrast to the circular array of FIGS. 9A and 9 b, each of LED die 100a to 100 f of FIGS. 10A and 10B may be oriented along a same axis (e.g.,the vertical axis of FIG. 10A), and anode and cathode pads 184 and 186may be interdigitated. By providing that LED die 100 a to 100 f of thecircular array are spaced symmetrically relative to the perimeter oflens 190, a more uniform and/or efficient light output may be providedthrough lens 190. As before, LED die 100 a to 100 f may bridge gap 196between anode and cathode pads 184 and 186. While each LED die 100 a to100 f is shown with an individual phosphor layer 140 as discussed abovewith respect to FIG. 1, a continuous phosphor layer may be provided overall of the LED die 100 a to 100 f as discussed above with respect toFIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 f may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180. Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 f over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 f over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler 192 between anode and cathode pads184 and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40μ.

In the assembly of FIGS. 10A and 10B, each LED die may have a width ofabout 0.35 mm and a length of about 0.47 mm, and ESD protection device194 may have a width of about 0.3 mm and a length of about 0.6 mm. Asdiscussed above with respect to FIGS. 3A to 3C, widths of metallic bonds(i.e., solder layers 188) between anode contacts 160 and anode pad 184and between cathode contacts 170 and cathode pad 186 (into the plane ofFIG. 7B) may be at least 60% of a width of the LED die (e.g., at least0.21 mm), at least 70% of a width of the LED die (e.g., at least 0.25mm), or even at least 90% of a width of the LED die (e.g., at least 0.32mm). By providing relatively large surface areas of contact, electricaland thermal resistances may be reduced. By providing that all of LEDs100 a to 100 f are sufficiently spaced from a perimeter of lens 190, anefficiency of light transmission through lens 190 may be improved. Whilelens 190 is not shown in the cross-section of FIG. 7B, it will beunderstood that lens 190 may substantially form a hemisphere on submount180 surrounding all of LED die 100 a to 100 f.

FIG. 11A is a plan view of a submount 180 including anode and cathodepads 184 and 186 without LED die, and FIG. 11B is a plan view of anassembly including submount 180 with LED die 100 a to 100 d mountedthereon. A separate cross-sectional view is not provided for thestructure of FIGS. 11A and 11B because the cross-sectional view would besubstantially the same as that shown in FIG. 7A. As shown, four LED die100 a to 100 d may be electrically coupled in parallel between anode andcathode pads 184 and 186 of submount 180. Moreover, portions of anodepad 184 may extend between opposing portions of cathode pad 186, and LEDdie 100 a to 100 d may bridge gap 196 between anode and cathode pads 184and 186. Moreover, all of LED die 100 a to 100 d may be provided withina circular area of a same lens 190. Each LED die 100 a to 100 d may beprovided with an individual phosphor layer 140 as discussed above withrespect to FIG. 1, or a continuous phosphor layer may be provided overall of LED die 100 a to 100 d as discussed above with respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts (160 and 170) of LED die 100 a to 100 d maybe asymmetric, with cathodes accounting for at least 70% of the combinedcontact area, at least 80% of the combined contact area, or even atleast 90% of the combined contact area. Accordingly, LED die 100 a to100 d may asymmetrically bridge the gap 196 between anode and cathodepads 184 and 186 of submount 180. Stated in other words, a contact areabetween cathode contacts and cathode pad 186 may be significantlygreater than a contact area between anode contacts and anode pad 184,and portions of LED die 100 a to 100 d over cathode pad 186 may besignificantly greater than portions of LED die 100 a to 100 d over anodepad 184.

As discussed above, a reflective and electrically insulating filler maybe provided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler between anode and cathode pads 184and 186, light loss into a less reflective submount body may be reduced,and efficiency may thus be improved. A body of submount body 180, forexample, may be alumina and/or aluminum nitride, and the filler may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller therein) may be about 75 μm or less, or even less than about 40μm. Further dimensions of submount 180 and LED die 100 a to 100 d areshown in FIGS. 11A and 11B with all dimensions given in units ofmillimeters (mm).

In the assembly of FIG. 11B, LED die 100 a to 100 d are arranged in arectangular array of 2 rows and 2 columns (with each row including asame number of LED die and with each column including a same number ofLED die). Spacing between adjacent columns of LED die may be about 0.05mm, spacings between adjacent rows of LED die may be about 0.075 mm, andall of the LED die may be provided within a circular perimeter of a lens190 having a diameter of about 2.55 mm. Each LED die may have a width ofabout 0.7 mm and a length of about 0.7 mm. As discussed above withrespect to FIGS. 3A to 3C, widths of metallic bonds (i.e., solder layers188) between LED anode contacts and anode pads 184 and between LEDcathode contacts and cathode pads 186 (in the horizontal direction ofFIG. 11B) may be at least 60% of a width of the LED die (e.g., at least0.42 mm), at least 70% of a width of the LED die (e.g., at least 0.49mm), or even at least 90% of a width of the LED die (e.g., at least 0.63mm). By providing relatively large surface areas of contact, electricaland thermal resistances may be reduced. By providing that all of LEDs100 a to 100 d are sufficiently spaced from a perimeter of lens 190, anefficiency of light transmission through lens 190 may be improved. Whilea cross-section of lens 190 is not shown, it will be understood thatlens 190 may substantially form a hemisphere on submount 180 surroundingall of LED die 100 a to 100 d.

FIG. 12A is a plan view of a submount 180 including anode and cathodepads 184 and 186 without LED die, FIG. 12B is a plan view of an assemblyincluding submount 180 with LED die 100 a to 100 v mounted thereon, andFIG. 12C is a cross-sectional view take through LED die 100 a, 100 j,100 m, and 100 v (as indicated by section line 12C-12C′). In FIGS. 12A,12B, and 12C, an array of twenty two LED die 100 a to 100 v areelectrically coupled in parallel between anode and cathode pads 184 and186 of submount 180. As shown, anode and cathode pads 184 and 186 may beinterdigitated, and LED die 100 a to 100 v may bridge gap 196 betweenanode and cathode pads 184 and 186. Moreover, all of LED die 100 a to100 v may be provided within a circular area of a same lens 190. Whileeach LED die 100 a to 100 v is shown with an individual phosphor layer140 as discussed above with respect to FIG. 1, a continuous phosphorlayer may be provided over all of the LED die 100 a to 100 v asdiscussed above with respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 v may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180. Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 v over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 v over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler 192 between anode and cathode pads184 and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc. A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40 μm.

In the assembly of FIGS. 12A, 12B, and 12C, LED die 100 a to 100 v arearranged in a linear array of four rows, and LED die of at least someadjacent rows may be offset so the array does not have conventionalcolumns. By providing that central rows (or lines) of the array arelonger than peripheral rows (or lines) of the array (e.g., that centralrows include a greater number of LED die than peripheral rows), anincreased number of LED die may be provided in the array whilemaintaining a sufficient spacing between all of the die and a perimeterof lens 190. Accordingly, a greater light output may be obtained withoutsignificantly reducing an efficiency of output from perimeter LED die ofthe array. As used herein, a line of LED die may refer to any lineararrangement of LED die, such as a column of LED die or a row of LED die.

Spacings between adjacent LED die in a row may be about 0.05 mm,spacings between LED die of adjacent rows may be about 0.075 mm, and allof the LED die may be provided within a circular perimeter of a lens 190having a diameter of about 3 mm. Each LED die may have a width of about0.35 mm and a length of about 0.47 mm. As discussed above with respectto FIGS. 3A to 3C, widths of metallic bonds (i.e., solder layers 188)between anode contacts 160 and anode pad 184 and between cathodecontacts 170 and cathode pad 186 (in the horizontal direction of FIG.12B and into the plane of FIG. 12C) may be at least 60% of a width ofthe LED die (e.g., at least 0.21 mm), at least 70% of a width of the LEDdie (e.g., at least 0.25 mm), or even at least 90% of a width of the LEDdie (e.g., at least 032 mm). By providing relatively large surface areasof contact, electrical and thermal resistances may be reduced. Byproviding that all of LEDs 100 a to 100 v are sufficiently spaced from aperimeter of lens 190, an efficiency of light transmission through lens190 may be improved. While lens 190 is not shown in the cross-section ofFIG. 12C, it will be understood that lens 190 may substantially form ahemisphere on submount 180 surrounding all of LED die 100 a to 100 v.

FIG. 13A is a plan view of a submount 180 including anode and cathodepads 184 and 186 without LED die, and FIG. 13B is a plan view of anassembly including submount 180 with 54 LED die 100 a to 100 bbb mountedthereon. A separate cross-sectional view is not provided because thecross-sectional structure will be understood in light of the previouslyprovided cross-sections. A cross-section taken through LED die 100 a,100 j, 100 p, and 100 cc would be substantially the same as thatillustrated in FIG. 12C.

In FIGS. 13A and 13B, an array of 54 LED die 100 a to 100 bbb areelectrically coupled in parallel between anode and cathode pads 184 and186 of submount 180. As shown, anode and cathode pads 184 and 186 may beinterdigitated, and LED die 100 a to 100 bbb may bridge gap 196 betweenanode and cathode pads 184 and 186. Moreover, all of LED die 100 a to100 bbb may be provided within a circular area of a same lens 190. Whileeach LED die 100 a to 100 bbb may have an individual phosphor layer 140as discussed above with respect to FIG. 1, a continuous phosphor layermay be provided over all of LED die 100 a to 100 bbb as discussed abovewith respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts of the LED die may be asymmetric, withcathode contacts accounting for at least 70% of the combined contactarea, at least 80% of the combined contact area, or even at least 90% ofthe combined contact area. Accordingly, LED die 100 a to 100 bbb mayasymmetrically bridge the gap 196 between anode and cathode pads 184 and186 of submount 180. Stated in other words, a contact area betweencathode contacts and cathode pad 186 may be significantly greater than acontact area between anode contacts and anode pad 184, and portions ofLED die 100 a to 100 bbb over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 bbb over anode pad 184.

In addition, a reflective and electrically insulating filler may beprovided on submount body 182 between anode and cathode pads 184 and186. By providing reflective filler between anode and cathode pads 184and 186, light loss into a less reflective submount body may be reduced,and efficiency may thus be improved. Submount body, for example, may bealumina and/or aluminum nitride, and filler may be white solder mask, alow modulus material (e.g., a silicone, a gel, etc.) loaded withtitanium oxide particles, etc. A width of gap 196 (and filler therein)may be about 75 μm or less, or even less than about 40 μm.

In the assembly of FIGS. 13A and 13B, LED die 100 a to 100 bbb arearranged in a linear array of seven rows (or horizontal lines) and tencolumns (or vertical lines). Moreover, central rows of the array arelonger than peripheral rows of the array, so that central rows include agreater number of LED die than peripheral rows. Similarly, centralcolumns of the array are longer than peripheral columns of the array, sothat central rows include a greater number of LED die than peripheralcolumns. By providing that central rows and/or columns of the array arelonger than peripheral rows and/or columns of the array, an increasednumber of LED die may be provided in the array while maintaining asufficient spacing between all of the die and a perimeter of lens 190.Accordingly, a greater light output may be obtained withoutsignificantly reducing an efficiency of output from perimeter LED die ofthe array. As used herein, a line of LED die may refer to any lineararrangement of LED die, such as a column of LED die or a row of LED die.

Spacings between adjacent LED die in a row may be about 0.05 mm,spacings between LED die of adjacent rows may be about 0.075 mm, and allof the LED die may be provided within a circular perimeter of a lens 190having a diameter of about 4.42 mm. Each LED die may have a width ofabout 0.35 mm and a length of about 0.47 mm. As discussed above withrespect to FIGS. 3A to 3C, widths of metallic bonds (i.e., solder layers188) between anode contacts 160 and anode pad 184 and between cathodecontacts 170 and cathode pad 186 (in the horizontal direction of FIG.12B and into the plane of FIG. 12C) may be at least 60% of a width ofthe LED die (e.g., at least 0.21 mm), at least 70% of a width of the LEDdie (e.g., at least 0.25 mm), or even at least 90% of a width of the LEDdie (e.g., at least 0.32 mm). By providing relatively large surfaceareas of contact, electrical and thermal resistances may be reduced. Byproviding that all of LEDs 100 a to 100 bbb are sufficiently spaced froma perimeter of lens 190, an efficiency of light transmission throughlens 190 may be improved. While lens 190 is not shown in across-section, it will be understood that lens 190 may substantiallyform a hemisphere on submount 180 surrounding all of LED die 100 a to100 bbb.

FIG. 14A is a plan view of a submount 180 including anode pad 184,cathode pad 186, and island pads 185 without LED die, FIG. 14B is a planview of an assembly including submount 180 with LED die 100 a to 100 pmounted thereon, and FIG. 14C is a cross-sectional view take through LEDdie 100 c to 100 f (as indicated by section line 14C-14C′). In FIGS.14A, 14B, and 14C, an array of 16 LED die 100 a to 100 p areelectrically coupled in series between anode and cathode pads 184 and186 of submount 180.

More particularly, island pads 185 may provide electrical connectionbetween LED die that are electrically adjacent in the series connectionbetween anode and cathode pads 184 and 186. Moreover, anode, cathode andisland pads 184, 186, and 185 may be separated by gaps 196 and/orreflective and electrically insulating filler 192. Electrical couplingmay thus be provided from anode pad 184 through LED die 100 a, 100 b,100 c, . . . 100 p (in alphabetical order) to cathode pad 105. Moreover,each island pad 185 may provide electrical coupling between an anodecontact 160 and a cathode contact of electrically adjacent LED die, andeach LED die may bridge a gap between anode pad 184 and an island pad185, between two island pads 185, or between an island pad 185 andcathode pad 186.

In addition, all of LED die 100 a to 100 p may be provided within acircular area of a same lens 190. While each LED die 100 a to 100 p isshown with an individual phosphor layer 140 as discussed above withrespect to FIG. 1, a continuous phosphor layer may be provided over allof the LED die 100 a to 100 p as discussed above with respect to FIG. 2.

As discussed above with respect to FIGS. 3A to 3C, surface areas ofanode and cathode contacts 160 and 170 may be asymmetric, with cathodes170 accounting for at least 70% of the combined contact area, at least80% of the combined contact area, or even at least 90% of the combinedcontact area. Accordingly, LED die 100 a to 100 v may asymmetricallybridge the gap 196 between anode and cathode pads 184 and 186 ofsubmount 180, Stated in other words, a contact area between cathodecontacts 170 and cathode pad 186 may be significantly greater than acontact area between anode contacts 160 and anode pad 184, and portionsof LED die 100 a to 100 v over cathode pad 186 may be significantlygreater than portions of LED die 100 a to 100 v over anode pad 184.

In addition, a reflective and electrically insulating filler 192 may beprovided on submount body 182 between anode, island, and cathode pads184, 185, and 186. By providing reflective filler 192 between pads 184,185, and 186, light loss into a less reflective submount body 182 may bereduced, and efficiency may thus be improved. Submount body 182, forexample, may be alumina and/or aluminum nitride, and filler 192 may bewhite solder mask, a low modulus material (e.g., a silicone, a gel,etc.) loaded with titanium oxide particles, etc, A width of gap 196 (andfiller 192 therein) may be less than about 75 μm or even less than about40 μm.

In the assembly of FIGS. 14A, 14B, and 14C, LED die 100 a to 100 p arearranged in a linear array of four rows (or horizontal lines) and fourcolumns (or vertical lines). Moreover, central rows of the array arelonger than peripheral rows of the array so that central rows have alarger number of LED die than peripheral rows, and central columns ofthe array are longer than peripheral columns of the array so thatcentral columns have a larger number of LED die than peripheral columns.By providing that central rows and/or columns of the array are longerthan peripheral rows and/or columns of the array, an increased number ofLED die may be provided in the array while maintaining a sufficientspacing between all of the die and a perimeter of lens 190. Accordingly,a greater light output may be obtained without significantly reducing anefficiency of output from perimeter LED die of the array. As usedherein, a line of LED die may refer to any linear arrangement of LEDdie, such as a column of LED die or a row of LED die.

Spacings between adjacent LED die in a row may be about 0.05 mm,spacings between LED die of adjacent rows may be about 0.05 mm, and allof the LED die may be provided within a circular perimeter of a lens 190having a diameter of about 3 mm. Each LED die may have a width of about0.35 mm and a length of about 0.47 mm. As discussed above with respectto FIGS. 3A to 3C, widths of metallic bonds (i.e., solder layers 188)between anode contacts 160 and respective pads 184/185 and betweencathode contacts 170 and respective pads 185/186 (in the horizontaldirection of FIG. 14B and into the plane of FIG. 14C) may be at least60% of a width of the LED die (e.g., at least 0.21 mm), at least 70% ofa width of the LED die (e.g., at least 0.25 mm), or even at least 90% ofa width of the LED die (e.g., at least 0.32 mm). By providing relativelylarge surface areas of contact, electrical and thermal resistances maybe reduced. By providing that all of LEDs 100 a to 100 p aresufficiently spaced from a perimeter of lens 190, an efficiency of lighttransmission through lens 190 may be improved. While lens 190 is notshown in the cross-section of FIG. 14C, it will be understood that lens190 may substantially form a hemisphere on submount 180 surrounding allof LED die 100 a to 100 p.

FIG. 15A is a plan view illustrating a submount 180 with anode, island,and cathode pads 184, 185, and 186 for a series array of LED die, andFIG. 15B is a plan view of the submount of FIG. 15A populated with aserially connected array of LED die 100 a to 100 p. The structure ofFIGS. 15A and 15B is similar to that of FIGS. 14A, 14B, and 14C, withthe difference being that the submount of FIGS. 15A and 15B is providedfor larger LED die having dimensions of 0.7 mm by 0.7 mm. Otherdimensions of FIGS. 15A and 15B are provided in millimeters (mm). InFIG. 15B, the current path traverses vertically through each column fromanode pad 184 to cathode pad 186. More particularly, the current pathtraverses down through the left most column (including LED die 100 a to100), up through the next column (including LED die 100 c to 100 f),down through the next column (including LED die 100 g to 100 j), upthrough the next column (including LED die 100 k to 100 n), and downthrough the left most column (including LED die 100 o to 100 p).

FIG. 16A is a plan view illustrating a submount 180 with anode, island,and cathode pads 184, 185, and 186 for a series array of LED die, andFIG. 16B is a plan view of the submount of FIG. 16A populated with aserially connected array of seventeen LED die 100 a to 100 q. Thestructure of FIGS. 16A and 16B is similar to that of FIGS. 15A and 15B,with differences being that the submount of FIGS. 16A and 16B provideshorizontal current paths and offsets between LED die of adjacent rows.Dimensions of FIGS. 16A and 16B are provided in millimeters (mm). InFIG. 16B, the current path traverses horizontally through each row fromanode pad 184 to cathode pad 186. More particularly, the current pathtraverses from right to left through the uppermost row (including LEDdie 100 a to 100 b), left to right through the next row (including LEDdie 100 c to 100 f), right to left through the next row (including LEDdie 100 g to 100 k), left to right through the next row (including LEDdie 100 l to 100 o), and right to left through the bottom most row(including LED die 100 p to 100 q).

FIG. 17A is a plan view illustrating yet another submount 180 withanode, island, and cathode pads 184, 185, and 186 for a series array ofLED die, and FIG. 17B is a plan view of the submount of FIG. 17Apopulated with a serially connected array of sixteen LED die 100 a to100 p. The structure of FIGS. 17A and 17B is similar to that of FIGS.14A, 14B, and 14C. In FIG. 17B, the current path traverses verticallythrough each column from anode pad 184 to cathode pad 186. Moreparticularly, the current path traverses down through the left mostcolumn (including LED die 100 a to 100 b), up through the next column(including LED die 100 c to 100 f), down through the next column(including LED die 100 g to 100 j), up through the next column(including LED die 100 k to 100 n), and down through the left mostcolumn (including LED die 100 o to 100 p).

As discussed above, for example, with respect to FIGS. 7B, 8B, 9B, 10B,12C, and 14C, individual phosphor layers 140 may be provided for eachLED die 100. According to other embodiments, a continuous and conformalphosphor layer 140′ may be provided on the array of LED die 100 and onportions of the submount between LED die as shown in FIG. 18. Theconformal phosphor layer 140′, for example, may have a thickness that isless than a thickness of the LED die 100 and that is less than half of aspacing between adjacent LED die 100. With either individual orcontinuous phosphor layers 140 or 140′, a single lens 190 may beprovided on the array as shown in FIG. 19. While FIGS. 18 and 19 show aseries arrangement of LED die 100 on island pads 185, a continuous andconformal phosphor layer 140′ and/or a lens may be provided on any ofthe parallel or series arrays discussed above.

According to still other embodiments, a dam 195 may surround the arrayof LED die 100 as shown in the cross-sectional view of FIG. 20, and thedam 195 may be used to confine a phosphor layer 140″ that may bedispensed as a liquid therein and then solidified. The dam 195 andphosphor layer 140″ may be substituted for a lens 190 and phosphor layer140/140′ in any of the structures discussed above. The dam 195, forexample, may define a perimeter surrounding the array of LED die 100,wherein the perimeter defined by the dame 195 has a placement anddimensions corresponding to those of a perimeter of a lens 190 asdiscussed above with respect to FIGS. 7A, 8A, 9A, 10A, 11B, 12B, 13B,14B, and 16B. As shown in FIG. 20, phosphor layer 140″ may have athickness that is greater than a thickness of LED die 100 (includingcathode/anode contacts and bonding metal 188.) While dam 195 and thickphosphor layer 140″ are shown with a series array of LED die 100 andisland pads 185, dam 195 and thick phosphor layer 140″ may be used withany of the parallel or series structures discussed above.

Examples of LED assemblies according to various embodiments will now bediscussed with respect to the photographs of FIGS. 21A-B and 22A-D. InFIG. 21A, an LED assembly includes an array of sixteen LED dieelectrically coupled in series on a submount and encapsulated in acommon lens, and in FIG. 21B, the LED assembly (including submount andLED die) is shown without the lens. Electrically conductive anode,island, and cathode pads of the submount of FIGS. 21A and 21B, forexample, may be provided substantially as shown in FIG. 15A (with mirrorimage reversal). As shown, LED die of the array may be arranged incolumns (more generally referred to as lines) with the serial currentpath defined up and down through columns of the array. Moreover,different columns of LEDs may include different numbers of LED dieand/or LED die of adjacent columns may be offset so that the relativelylarge array of LED die may be arranged with sufficient spacing between aperimeter of the lens and all of the LED die of the array. Accordingly,an efficiency of light output from the array of LED die through the lensmay be improved.

In the LED assembly of FIGS. 21A-B, sixteen LED die may be solder bondedto electrically conductive pads of the submount as discussed above, forexample, with respect to FIGS. 1-6 and 15A-B. Each LED die of the arraymay have dimensions of about 350 micrometers by about 470 micrometers(for a surface area of about 164,500 square micrometers or about 0.1645square mm), to provide a total active light emitting area for the LEDassembly of about 2.63 square mm. The submount may have dimensions ofabout 5 mm by 5 mm for a surface area of about 25 square mm. Spacingsbetween adjacent LED die may be about 425 micrometers. Moreover, LED diearrangements/spacings shown in FIG. 21B may provide improved luminousflux, for example, by reducing light absorption between LED die and/orby maintaining adequate spacings between all LED die of the array and aperimeter of the lens.

After testing, each of the 16 LED die may have a forward operatingvoltage Vf of about 3 volts, and the serially coupled array of the 16LED die may have a forward operating voltage of about 46 volts. With anoperating current of about 21.9 mA through the serially coupled array of16 LED die, a forward operating voltage of about 46 volts, and aresulting power of about 1 Watt, the LED assembly of FIGS. 21A-Bprovided a luminous flux of about 146 lm and a color rendering index(CRI) of about 70.

A similar LED assembly with a smaller submount and a serially coupledarray of smaller LED die may be provided as shown in FIGS. 22A-D. InFIG. 22A, an LED submount is provided for an array of sixteen LED dieelectrically coupled in series, and FIG. 22B-C show arrays of LED diepackaged on the submount of FIG. 22A with different lenses/phosphors.Electrically conductive anode, island, and cathode pads of the submountof FIGS. 22A-D, for example, may be provided substantially as shown inFIGS. 14A and/or 17A. As shown, LED die of the array may be arranged inrows (more generally referred to as lines) with the serial current pathdefined to the left and right through rows of the array. Moreover,different rows and/or columns of LEDs may include different numbers ofLED die so that the relatively large array of LED die may be arrangedwith sufficient spacing between a perimeter of the lens and all of theLED die of the array. Accordingly, an efficiency of light output fromthe array of LED die through the lens may be improved.

In the LED assembly of FIGS. 22A-D, sixteen LED die may be solder bondedto electrically conductive pads of the submount as discussed above, forexample, with respect to FIGS. 1-6, 14A-C, and 17A-B. Each LED die ofthe array may have dimensions of about 240 micrometers by about 470micrometers (for a surface area of about 76,800 square micrometers orabout 0.0768 square mm), to provide a total active light emitting areafor the LED assembly of about 1.23 square mm. The submount may havedimensions of about 3.5 mm by 3.5 mm for a surface area of about 12.25square mm. Moreover, LED die arrangements/spacings for the LED arrays ofFIGS. 22A-D may provide improved luminous flux, for example, by reducinglight absorption between LED die and/or by maintaining adequate spacingsbetween all LED die of the array and a perimeter of the lens.

After testing, each of the 16 LED die may have a forward operatingvoltage Vf of about 3.08 volts, and the serially coupled array of the 16LED die may have a forward operating voltage of about 49.4 volts. Withan operating current of about 21.9 mA through the serially coupled arrayof 16 LED die, a forward operating voltage of about 49.4 volts, and aresulting power of about 1.08 Watts (electrical Watts) consumed by thearray of 16 LED die, the LED assembly of FIG. 22B provided a radiantflux of about 537 mW at a wavelength of 454 nm, the LED assembly of FIG.22C provided a cool white output measured as 133 lumens at 6500K, andthe LED assembly of FIG. 22D provided a warm white output measured as104 lumens at 3080K. The different outputs of the assemblies of FIGS.22B-D resulted from different phosphorcombinations/compositions/concentrations/etc. used with the differentassemblies. Measured individually, each LED die of FIGS. 22B-D maygenerate a light output having a wavelength of about 454 nm with anoperating current of about 20 ma at a power of about 32 mw.

Accordingly, some embodiments may enable relatively small area LEDsubmounts (e.g., 25 square mm or less, or even 12.25 square mm or less)for higher voltage application LED arrays. Such LEDs, for example, mayprovide Vfs of at least about 12V, at least about 24V, at least about36V, at least about 42V, at least about 48V, at least about 50V, or evengreater than 54V (assuming that each LED die has a Vf of about 3 V) withcorresponding higher efficiencies due to lower current requirements.Certain embodiments may enable very high voltage operation (e.g.,greater than about 45V as discussed above with respect to FIGS. 21A-Band 22A-D) with efficiency numbers for individual LED die as set forth,for example, in U.S. application Ser. No. 13/018,013 filed Jan. 31,2011, the disclosure of which is hereby incorporated herein in itsentirety by reference.

According to some embodiments discussed above, LED assemblies mayinclude serially coupled LED die on a submount having a total surfacearea in the range of about 0.5 square mm to about 5.0 square mm, andmore particularly, in the range of about 1 square mm to about 3 squaremm. Each individual LED die have a surface area in the range of about0.01 square mm to about 0.3 square mm, and more particularly, in therange of about 0.05 square mm to about 0.2 square mm. Accordingly, aserially coupled array of 16 LED die may provide a combined LED diesurface area in the range of about 0.16 square mm to about 4.8 squaremm, and more particularly, in the range of about 0.8 square mm to about3.2 square mm. With an array of 16 LED die electrically coupled inseries, the array may provide a total forward operating voltage greaterthan about 45 volts, greater than about 48 volts, greater than about 50volts, or even greater than about 54 volts. As discussed above, the LEDdie may be solder bonded to submount pads eliminating wirebonds betweenLED die of the array and improving electrical coupling between LED dieof the array.

The numerous embodiments discussed above may thus provide an electronicdevice including a plurality of light emitting diode (LED) dieelectrically and mechanically bonded to a submount, with each LED dieincluding a diode region, an anode contact, and a cathode contact. Moreparticularly, each LED die may include the diode region having first andsecond opposing faces and including therein an n-type layer and a p-typelayer with the first face between the second face and the packagingsubstrate. The anode contact of each LED die may ohmically contact thep-type layer and may extend on the first face between the first face andthe packaging substrate, and the cathode contact may ohmically contactthe n-type layer and may extend on the first face between the first faceand the packaging substrate. Moreover, adjacent LED die may be spacedapart by distances in the range of about 20 micrometers to about 500micrometers, by distances in the range of about 40 micrometers to about150 micrometers, or even by distances in the range of about 50micrometers to about 100 micrometers.

These electronic devices may be assembled by sequentially (andindividually) placing each of a plurality of light emitting diode (LED)die on the submount, and by performing a reflow operation to provide ametallic bond between anode and cathode contacts of each of the LED dieand the submount. Moreover, the metallic bonds may be provided usingeutectic solder bonds. By sequentially/individually placing relativelysmall LED die, the LED die can be individually tested to provideimproved yield relative to large area LED die and/or relative to arraysof LED die maintained on a growth substrate during placement operations.According to some embodiments, flux may be provided between the LED dieand the submount, and the reflow operation may be performed afterplacing all of the LED die on the submount. According to some otherembodiments, a temperature of the submount may be maintained above areflow temperature for metallic bonding while the plurality of LED dieare placed on the submount.

The plurality of LED die may be electrically coupled in series, whereineach of the plurality of LED die has a forward operating voltage in therange of about 2 volts to about 4 volts, and wherein a forward operatingvoltage of the serially coupled plurality of LED die is at least about12 volts. More particularly, each of the LED die may have a forwardoperating voltage in the range of about 2.5 volts to about 3.5 volts(e.g., about 3 volts), and the forward operating voltage of the seriallycoupled plurality of LED die may be at least about 12 volts, at leastabout 24 volts, at least about 36 volts, at least about 48 volts, oreven at least about 54 volts. For example, the plurality of seriallycoupled LED die may include at least about 4 LED die, at least about 8LED die, at least about 12 LED die, or even at least about 16 LED die.

According to some other embodiments, the plurality of LED die may beelectrically coupled in parallel. By using an array of a larger numberof smaller LED die in parallel as opposed to using fewer or even onelarger LED die, an effective yield of LED die may be improved because alarger percentage of a fabrication wafer will be converted to useful LEDdie when smaller die are produced. For example, the plurality ofparallel LED die may include at least about 4 LED die, at least about 8LED die, at least about 12 LED die, or even at least about 16 LED die.Going to LED die sizes beyond 1 mm or 1.4 mm may be prohibitive from acost and manufacturing perspective to provide desired performance andlight extraction. Instead of a 1.4 mm LED die, for example, four 700micrometer LED die may be used. Die yield percentage per wafer mayincrease as LED die size is reduced. For a 700 micrometer LED die, anextraction efficiency per chip may improve because the rations of outerto inner surface is reduced. Increasing a thickness of a large LED die(e.g., a 1.4 mm LED die) to increase extraction efficiency may beimpractical due to costs for dicing saw blades and for startingsubstrate thickness.

Moreover, the plurality of LED die may be bonded to a surface of thesubmount having a surface are of less than about 85 mm², less than about65 mm², less than about 30 mm², or even less than about 15 mm². As notedabove, arrays of LED die including at least 4, at least 8, at least 12,or even at least 16 LED die may be provided on these relatively smallsubmounts.

FIGS. 23A, 23B, and 23C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments of thepresent invention. FIG. 23D is a enlarged cross sectional view of thesubmount of FIGS. 23A, 23B, and 23C illustrating dimensions of top sideand bottom side metallizations, and FIG. 23E is a table providing alegend of materials and dimensions. A patterned metallization (e.g.,including electroless copper on titanium and/or gold) on the top side ofthe submount may provide a positive electrical contact 2301, a negativeelectrical contact 2303, and a plurality of interconnection islands 2305therebetween. As discussed above, each of the interconnection islandsmay provide an electrical coupling between two serially coupled LEDs inan assembled device. Moreover, electrically insulating gaps 2307 mayseparate the positive electrical contact 2301, the negative electricalcontact 2303, and the interconnection islands 2305. By providing anoptically reflective surface of the metallization and by providing areflective material (e.g., white solder mask) in the electricallyinsulating gaps, a light output of the assembled device may be improved.

Moreover, electrically conductive via holes 2319 may provide electricalcoupling between positive and negative electrical contacts 2301 and 2303on the submount top side and respective positive and negative electricalcontacts on the submount bottom side. Backside electrical contacts 2321and 2323 may thus be soldered to a next level packaging substrate (e.g.,a printed circuit board or PCB) to provide electrical and mechanicalcoupling between the submount and the next level packaging substratewithout requiring wirebonds between the submount of FIGS. 23A-E. Inaddition, thermally conductive pad 2325 may be provided on the backsideof the submount between backside electrical contacts 2321 and 2323, andthermally conductive pad 2325 may be soldered to the next levelpackaging substrate to increase thermal coupling between the submountand the next level packaging substrate. Use of thermally conductive pad2325 on a thermally conductive but electrically insulating submountsubstrate (e.g., an aluminum nitride substrate) may thus increaseconduction of heat away from light emitting diodes on the front side ofthe submount. More particularly, backside electrical contacts 2321 and2323 and thermally conductive pad 2325 may be patterned from a samelayer of a same electrically and thermally conductive material(s) (e.g.,one or more layers of metals and/or metal alloys) so that electricallyconductive gaps 2327 are provided therebetween. More particularly, backside electrical contacts 2321 and 2323 and thermally conductive pad 2325may be patterned from a metallization including electroless copper ontitanium and/or gold. Thermally conductive pad 2325 may thus beelectrically isolated from electrical contact 2321, electrical contact2323, positive electrical contact 2301, negative electrical contact2303, and/or interconnection islands 2305.

FIG. 24 illustrates an enlarged top view of the submount of FIGS.23A-23E populated with 75 serially connected LEDs D1 to D75, and eachLED may have a forward voltage drop in the range of about 2.5 volts toabout 3.5 volts. By providing 75 serially connected LEDs with each LEDhaving a forward voltage drop of about 3 volts, for example, a voltagedrop of about 225 to 230 volts may be provided between positive andnegative electrical contacts 2301 and 2303. More particularly, the 75LEDs of FIG. 24 may be electrically coupled in series between positiveand negative electrical contacts 2301 and 2303 through theinterconnection islands 2305 (seventy four of which are included in theembodiment of FIGS. 23A-E and 24). Accordingly, a voltage of about 225volts may be applied between positive and negative electrical contacts2301 and 2303 to power the device.

The order of connection between the LEDs is according to the numbersthereof in the vertical columns of FIG. 24. For example, LED D1 iscoupled between positive electrical contact 2301 and LED D2; LED D2 iscoupled between LEDs D1 and D3; LED D3 is coupled between LEDs D2 andD4; LED D4 is coupled between LEDs D3 and D5; LED D5 is coupled betweenLEDs D4 and D6; etc. At the other end of the string, LED D72 is coupledbetween LEDs D71 and D73; LED 73 is coupled between LEDs D72 and D74;LED D74 is coupled between LEDs D73 and D75; and LED D75 is coupledbetween LED D74 and negative electrical contact 2303.

Metallization of positive/negative electrical contacts 2301 and 2303 andinterconnection islands 2305 and reflective solder mask materialprovided in the insulating gaps 2307 therebetween may thus provide areflective surface to improve light output from the LEDs in thecompleted device. Moreover, a reflective surface provided by themetallization and reflective solder mask material may extend well beyondthe LEDs to provide a reflective backing over an entirety of a lensprovided on the LEDs. According to some embodiments, a single opticalelement (e.g., phosphor layer and/or lens) may be provided on thesubmount including the 75 LEDs, the metallization, and the reflectivematerial as discussed above with respect to FIG. 19. Moreover, the 75LEDs may be confined within a substantially circular area of thesubmount having a diameter of no more than about 6 mm, and moreparticularly, no more than about 5 mm, and still more particularly, nomore than about 4.5 mm. A 225 to 230 volt device with 75 LEDs may thusbe assembled on a single submount with a single optical element (e.g., aphosphor layer, a lens, etc.) thereon, and all 75 LEDs may be providedin a central area of an 8 mm lens to improve light output in a submountpackage having dimensions of about 9 mm by 9 mm.

According to other embodiments, a phosphor light converting layer may beprovided on the LEDs as discussed above with respect to FIGS. 18 and 20.In embodiments without a lens (e.g., in embodiments including phosphorlayers as discussed above with respect to FIGS. 18 and 20), the tightlypacked LEDs may be provided on a still smaller submount (e.g., havingdimensions of about 5 mm by 5 mm) using the layout of FIGS. 23A-E and24.

More particularly, a dam (illustrated by the dashed circle 2395 of FIG.24) may surround the array of LEDs as discussed above with respect todam 195 of FIG. 20, and the dam 2395 may be used to confine a phosphorlayer that may be dispensed as a liquid therein and then solidified. Thephosphor layer may thus define a continuous optical coating on theplurality of LEDs and on the submount so that LEDs D1 to D75 are betweenthe optical coating and the submount. More particularly, the phosphorlayer may include a layer of a transparent and/or translucent materialincluding a phosphor material (e.g., a yellow phosphor that convertsblue light to yellow light) therein. Blue emitting LEDs may thus beassembled on the submount with a yellow phosphor layer provided thereonso that a blue shifted yellow light output is generated. According tosome other embodiments, the phosphor layer may include first and seconddifferent phosphor materials configured to emit different wavelengths oflight responsive to light generated by the assembled LEDs.

According to still other embodiments, the phosphor layer may includefirst, second, and third different phosphor materials configured to emitrespective first, second, and third different wavelengths of lightresponsive to light generated by the assembled LEDs. For example, theassembled LEDs may generate blue light, and the phosphor layer mayinclude a binder, a first phosphor (e.g., an aluminum garnet-basedphosphor) that is configured to down-convert blue light to radiationhaving a peak wavelength in the green color range that has a full widthhalf maximum bandwidth that extends into the cyan color range, a secondphosphor (e.g., an aluminum garnet-based phosphor) that is configured todown-convert blue light to radiation having a peak wavelength in theyellow color range, and a third phosphor (e.g., a nitride-based and/oroxynitride-based phosphor) that is configured to down-convert blue lightto radiation having a peak wavelength in the red color range. Threephosphor systems are discussed, for example, in U.S. Patent PublicationNo. 2011/0220929, to Collins et al., entitled Warm White LEDs HavingHigh Color Rendering Index Values And Related Luminophoric Mediums,assigned to the assignee of the present application, the entiredisclosure of which is hereby incorporated by reference as if set forthfully herein (hereinafter referred to as “the '929 Publication”).

In addition, a thickness of the continuous optical coating may begreater than a thickness of each of the LEDs relative to the top surfaceof the submount, and a surface of the continuous optical coatingopposite the submount may be substantially planar over the areaincluding the LEDs. While a planar phosphor layer may be used asdiscussed above, other optical elements may be used on LEDs for thesubmounts of FIGS. 23A-E and 24 such as a conformal phosphor layer(s) asdiscussed above with respect to FIG. 18 and/or a convex lens element(s)as discussed above with respect to FIG. 19.

Moreover, an optic area may be defined by an area of the submountcovered by the continuous optical coating (e.g., an area of the submountwithin dam 2395, and/or an area of the submount covered by a convex lenselement), and the LEDs on the submount (e.g., LEDs D1 to D75) may beconfigured to generate at least 20 lumens per square millimeter of theoptic area while delivering at least 100 lumens per watt of powerconsumed by the plurality of light emitting diodes between thecontinuous optical coating and the submount while delivering at least600 absolute lumens from the plurality of light emitting diodes betweenthe continuous optical element (e.g., phosphor layer) and the submount.More particularly, the LEDs on the submount may be configured togenerate at least 25 lumens per square millimeter of the optic areawhile delivering at least 100 lumens per watt of power consumed.According to some embodiments, the optic area may be in the range ofabout 20 square millimeters to about 200 square millimeters.

Each LED of FIG. 24 (e.g., LEDs D1 to D75) may have a structure asdiscussed above, for example, with respect to FIGS. 1 and 2. Each LED,for example, may include a diode region having first and second opposingfaces including therein an n-type layer and a p-type layer, an anodecontact that ohmically contacts the p-type layer and extends on thefirst face, and a cathode contact that ohmically contacts the n-typelayer and extends on the first face. In addition, a support substratemay be provided on the second face of the diode region, with the dioderegion being between the support substrate and the anode and cathodecontacts, and with the support substrate having a thickness of at leastabout 50 micrometers. The support substrate, for example, may be aportion of an epitaxial growth substrate remaining after dicing the LEDfrom a processing wafer so that the support substrate and the dioderegion have aligned crystal structures. According to some otherembodiments, the support substrate may be bonded to the diode regionafter removing the diode region from a growth substrate. Once the LED isassembled on the submount as shown in FIG. 24, the diode region may thusbe between the support substrate and the submount.

Each LED (e.g., each of LEDs D1 to D75) may be mechanically andelectrically coupled to respective interconnection islands 2905,positive electrical contact 2901, and/or negative electrical contact2903 using first and second metallic (e.g., solder) bonds locatedphysically between the LED and the submount as discussed above, forexample, with respect to FIGS. 1 and/or 2. More particularly, each LEDmay include an anode contact electrically and mechanically coupled toone of interconnection islands 2905, positive electrical contact 2901,and/or negative electrical contact 2903 using a first metallic bondphysically located between the anode contact and the submount.Similarly, each LED may include a cathode contact electrically andmechanically coupled to another of interconnection islands 2905,positive electrical contact 2901, and/or negative electrical contact2903 using a second metallic bond physically located between the cathodecontact and the submount. Accordingly, LEDs may be assembled on thesubmount of FIGS. 23A and 24 without wirebonding. Adjacent LEDs of thearray illustrated in FIG. 24 may thus be spaced apart by a distance inthe range of about 20 micrometers to about 500 micrometers.

As further shown in FIGS. 23A and 24, portions of metallization islands(e.g., 2305-1 to 2305-5) and gaps 2307 therebetween may extend to aperimeter of the metallization. Accordingly, positive and negativeelectrical contacts 2301 and 2303 may be separated by electricallyisolated/separated portions of the metallization (e.g., extensions ofmetallization islands used to interconnect LEDs of the array). Adifference in voltage between any two adjacent metallization regions maythus be reduced thereby reducing a possibility of metal migration (e.g.,silver migration) between two adjacent areas of metallization. Forexample, a voltage difference between any two adjacent metallizationregions may be less than 60 volts, and more particularly, less than 40volts, and still more particularly, less than 30 volts, even though 225volts is applied between positive and negative electrical contacts 2301and 2303.

As shown in FIG. 24, metallization region 2305-1 may be an oversizedinterconnection island providing electrical connection between LEDs D10and D11; metallization region 2305-1 may be an oversized interconnectionisland providing electrical connection between LEDs D10 and D11;metallization region 2305-2 may be an oversized interconnection islandproviding electrical connection between LEDs D25 and D26; metallizationregion 2305-3 may be an oversized interconnection island providingelectrical connection between LEDs D42 and D43; metallization region2305-4 may be an oversized interconnection island providing electricalconnection between LEDs D58 and D59; metallization region 2305-5 may bean oversized interconnection island providing electrical connectionbetween LEDs D71 and D72; metallization region 2305-6 may be anoversized interconnection island providing electrical connection betweenLEDs D4 and D5; metallization region 2305-7 may be an oversizedinterconnection island providing electrical connection between LEDs D17and D18; metallization region 2305-8 may be an oversized interconnectionisland providing electrical connection between LEDs D33 and D34;metallization region 2305-9 may be an oversized interconnection islandproviding electrical connection between LEDs D50 and D51; andmetallization region 2305-10 may be an oversized interconnection islandproviding electrical connection between LEDs D65 and D66. By providingthat regions 2305-1 to 2305-10 are used to interconnect respective LEDsof the array, an operating voltage of each region 2305-1 to 2305-10 maybe defined by LEDs to which it is connected.

While portions of metallization islands 2305-1 to 2305-10 shownextending to the perimeter of the metallization pattern are also used tocouple LEDs of adjacent columns, electrically isolated/floatingreflective portions of the metallization may provide the desiredreflectivity. Additional (optional) reflective and insulating gaps, forexample, may be provided along the dashed lines 2341 of FIG. 24 toelectrically isolate extended portions of metallization islands 2305-1to 2305-10 from the array of LEDs. According to still other embodiments,gaps 2307 between one or more of separate electrically isolated portions2305-1 to 2305-5 may be omitted and gaps 2307 between one or more ofseparate electrically isolated portions 2305-6 to 2305-10 may be omittedprovided that the extended portions are isolated from the LED array withgaps along the dashed lines 2341.

At 6 watts and 85 degrees C., the LED assembly of FIGS. 23A-D and 24 mayprovide a flux output (at a color temperature of about 3,000K) in therange of about 625 lumens to about 675 lumens, thereby providing anefficacy in the range of 100 lumens/watt to about 110 lumens/watt. At 15watts and 85 degrees C., the LED assembly of FIG. 24 may provide a fluxoutput (at a color temperature of about 3,000K) in the range of about1250 lumens to about 1350 lumens, thereby providing an efficacy in therange of 83 lumens/watt to about 90 lumens/watt. At 25 degrees C., theassembly may provide greater than 125 lumens per watt (at a colortemperature of 3000K). The LED assembly may be available over a fullrange of color temperatures from 2700K to 5000K (e.g., 2700K, 3000K,3500K, 4000K, or 5000K) and with options for minimum CRIs of 80, 85, or90. A viewing angle of 120 degrees may be provided with submountdimensions of 9 mm by 9 mm, and with an optical source (e.g., lens)having a diameter of 8 mm. Moreover, easywhite 4 and 2 step binning maybe available, and lifetimes greater than 50,000 hours may be available.

FIG. 25 is a photograph illustrating an array of submounts according toFIGS. 23A-23E populated with LEDs according to FIG. 24. FIG. 26 is aphotograph illustrating a submount populated with LEDs according to FIG.24 with a lens thereon according to FIG. 19 (without a phosphor layer).FIG. 27 is a photograph illustrating a an array of submounts accordingto FIGS. 23A-23E populated with LEDs according to FIG. 24 with aphosphor layer thereon according to FIG. 19. FIG. 28 is a photographillustrating a submount populated with LEDs according to FIG. 24 with aphosphor layer and lens thereon according to FIG. 19.

FIGS. 29A, 29B, and 29C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments of thepresent invention. FIG. 29D is a enlarged cross sectional view of thesubmount of FIGS. 29A, 29B, and 29C illustrating dimensions of top sideand bottom side metallizations, and FIG. 29E is a table providing alegend of materials and dimensions. A patterned metallization (e.g.,including electroless copper on titanium and/or gold) on the top side ofthe submount may provide a positive electrical contact 2901, a negativeelectrical contact 2903, and a plurality of interconnection islands 2905therebetween. As discussed above, each of the interconnection islandsmay provide an electrical coupling between two serially coupled LEDs inan assembled device. Moreover, electrically insulating gaps 2907 mayseparate the positive electrical contact 2901, the negative electricalcontact 2903, and the interconnection islands 2905. By providing anoptically reflective surface of the metallization and by providing areflective material (e.g., white solder mask) in the electricallyinsulating gaps, a light output of the assembled device may be improved.

Moreover, electrically conductive via holes 2919 may provide electricalcoupling between positive and negative electrical contacts 2901 and 2903on the submount top side and respective backside electrical contacts2921 and 2923 on the submount bottom side. Backside electrical contacts2921 and 2923 may thus be soldered to a next level packaging substrate(e.g., a printed circuit board or PCB) to provide electrical andmechanical coupling between the submount and the next level packagingsubstrate without requiring wirebonds. In addition, thermally conductivepad 2925 may be provided on the backside of the submount betweenbackside electrical contacts 2921 and 2923, and thermally conductive pad2925 may be soldered to the next level packaging substrate to increasethermal coupling between the submount and the next level packagingsubstrate. Use of thermally conductive pad 2925 on a thermallyconductive but electrically insulating submount substrate (e.g., analuminum nitride substrate) may thus increase conduction of heat awayfrom light emitting diodes on the front side of the submount. Moreparticularly, backside electrical contacts 2921 and 2923 and thermallyconductive pad 2925 may be patterned from a same layer of a sameelectrically and thermally conductive material(s) (e.g., one or morelayers of metals and/or metal alloys) so that electrically conductivegaps 2927 are provided therebetween. More particularly, back sideelectrical contacts 2921 and 2923 and thermally conductive pad 2925 maybe patterned from a metallization including electroless copper ontitanium and/or gold. Thermally conductive pad 2925 may thus beelectrically isolated from electrical contact 2921, electrical contact2923, positive electrical contact 2901, negative electrical contact2903, and/or interconnection islands.

FIG. 30A illustrates an enlarged view of the top side of the submount ofFIG. 29A. As discussed in greater detail below, the submount of FIG. 30Amay be populated with 6 strings of serially coupled LEDs with each ofthe strings being electrically coupled in parallel, and each LED mayhave a forward voltage drop of about 3 volts. More particularly, thestrings of serially coupled LEDs may be electrically coupled betweenpositive and negative electrical contacts 2901 and 2903 through theinterconnection islands 2905 (sixty six of which are included in theembodiment of FIGS. 29A-E and 30A-C). Accordingly, a voltage of about 36volts may be applied across positive and negative electrical contacts2901 and 2903 to power the device.

Moreover, gaps 2907′ may extend from a central regions of the submountsurrounding interconnection islands 2905 to electrically separatepositive and negative electrical contacts 2901 and 2903. With only asingle pair of such gaps 2907′ separating positive and negativeelectrical contacts 2901 and 2903, the full voltage difference betweenpositive and negative electrical contacts 2901 and 2903 may be providedacross gaps 2907′. To reduce a risk of shorting between electricalcontacts 2901 and 2903 due to metal migration across gaps 2907′,additional gaps 2907″ may be provided as indicated by dashed lines toreduce a voltage drop across any one of gaps 2907′ and/or 2907″ therebyreducing a risk of metal migration across gaps. By including all of gaps2907′ and 2907″, six electrically isolated regions may be provided toincrease an electrical separation between positive and negativeelectrical contacts 2901 and 2903 while maintaining a substantiallycircular reflective surface surrounding LEDs subsequently assembled onthe submount. Each of the electrically isolated regions may thus definean electrically conductive reflector that is electrically isolated fromeach of positive electrical contact 2901, negative electrical contact2903, and electrically conductive islands 2905.

According to some other embodiments, each of the six regions defined bygaps 2907′ and 2907″ may extend from (and thus be electrically connectedto) a respective one of interconnection islands 2905 so that each of thesix regions is fixed to an electrical potential of a respectiveinterconnection island during device operation so that none of the sixregions is allowed to float electrically. Accordingly, each of the threeregions on one side of the submount may be fixed to respective differentintermediate voltages between voltages of positive and negativeelectrical contacts 2901 and 2903, and each of the three regions on theother side of the submount may be fixed to respective differentintermediate voltages between voltages of positive and negativeelectrical contacts 2901 and 2903.

FIG. 30B illustrates the submount of FIGS. 29A-29E and 30A populatedwith 6 strings of 12 serially connected LEDs 2931 according toembodiments described herein. Seventy two LEDs may thus be providedwithin a substantially circular area having a diameter of less thanabout 6 mm, and more particularly, less than about 5 mm, and still moreparticularly, less than about 4.5 mm. The 6 strings of LEDs may beelectrically coupled in parallel between positive and negative contacts2901 and 2903. Each of the lines CP-1 to CP-6 represents a current pathfrom positive electrical contact 2901 through a respective string oftwelve LEDs 2931 to negative electrical contact 2903. Moreover, each LEDmay have a forward voltage drop in the range of about 2.5 volts to about3.5 volts. More particularly, each LED may have a forward voltage dropof about 3 volts so that each string of 12 LEDs has a voltage drop ofabout 36 volts to provide a lighting device having an operating voltageof about 36 volts. Moreover, a layout of the LEDs may be symmetricalabove and below a horizontal line through the center of the array.

FIG. 30C is a greatly enlarged view of a central portion of the submountof FIGS. 29A-E and 30A-B populated with six strings of twelve seriallycoupled LEDs as discussed above. The first string includes LEDs La1 toLa12 serially coupled between positive electrical contact 2901 andnegative electrical contact 2903 in an order from La1 to La12, the sixthstring includes LEDs Lf1 to Lf12 serially coupled between positiveelectrical contact 2901 and negative electrical contact 2903 in an orderfrom Lf1 to Lf12, and the first and sixth strings may be symmetricalabout a horizontal line through the center of the array. The secondstring includes LEDs Lb1 to Lb12 serially coupled between positiveelectrical contact 2901 and negative electrical contact 2903 in an orderfrom Lb1 to Lb12, the fifth string includes LEDs Le1 to Le12 seriallycoupled between positive electrical contact 2901 and negative electricalcontact 2903 in an order from Le1 to Le12, and the second and fifthstrings may be symmetrical about the horizontal line through the centerof the array. The third string includes LEDs Lc1 to Lc12 seriallycoupled between positive electrical contact 2901 and negative electricalcontact 2903 in an order from Lc1 to Lc12, the fourth string includesLEDs Ld1 to Ld12 serially coupled between positive electrical contact2901 and negative electrical contact 2903 in an order from Ld1 to Ld12,and the third and fourth strings may be symmetrical about the horizontalline through the center of the array.

In addition, a dam (illustrated by the dashed circle 2995 of FIG. 30A)may surround the array of LEDs as discussed above with respect to dam195 of FIG. 20, and the dam 2995 may be used to confine a phosphor layerthat may be dispensed as a liquid therein and then solidified. Thephosphor layer may thus define a continuous optical coating on theplurality of LEDs and on the submount so that the LEDs are between theoptical coating and the submount. More particularly, the phosphor layermay include a layer of a transparent and/or translucent materialincluding a phosphor material (e.g., a yellow phosphor that convertsblue light to yellow light) therein. Blue emitting LEDs may thus beassembled on the submount with a yellow phosphor layer provided thereonso that a blue shifted yellow light output is generated. According tosome other embodiments, the phosphor layer may include first and seconddifferent phosphor materials configured to emit different wavelengths oflight responsive to light generated by the assembled LEDs.

According to still other embodiments, the phosphor layer may includefirst, second, and third different phosphor materials configured to emitrespective first, second, and third different wavelengths of lightresponsive to light generated by the assembled LEDs. For example, theassembled LEDs may generate blue light, and the phosphor layer mayinclude a binder, a first phosphor (e.g., an aluminum garnet-basedphosphor) that is configured to down-convert blue light to radiationhaving a peak wavelength in the green color range that has a full widthhalf maximum bandwidth that extends into the cyan color range, a secondphosphor (e.g., an aluminum garnet-based phosphor) that is configured todown-convert blue light to radiation having a peak wavelength in theyellow color range, and a third phosphor (e.g., a nitride-based and/oroxynitride-based phosphor) that is configured to down-convert blue lightto radiation having a peak wavelength in the red color range. Threephosphor systems are discussed, for example, in U.S. Patent PublicationNo. 2011/0220929, to Collins et al., entitled Warm White LEDs HavingHigh Color Rendering Index Values And Related Luminophoric Mediums,assigned to the assignee of the present application, the entiredisclosure of which is hereby incorporated by reference as if set forthfully herein (hereinafter referred to as “the '929 Publication”).

In addition, a thickness of the continuous optical coating may begreater than a thickness of each of the LEDs relative to the top surfaceof the submount, and a surface of the continuous optical coatingopposite the submount may be substantially planar over the areaincluding the LEDs. While a planar phosphor layer may be used asdiscussed above, other optical elements may be used on LEDs for thesubmounts of FIGS. 29A-E and 30A-C such as a conformal phosphor layer(s)as discussed above with respect to FIG. 18 and/or a convex lenselement(s) as discussed above with respect to FIG. 19.

Moreover, an optic area may be defined by an area of the submountcovered by the continuous optical coating (e.g., an area of the submountwithin dam 2995, and/or an area of the submount covered by a convex lenselement), and the LEDs on the submount (e.g., LEDs La1-La12, Lb1-Lb12,Lc1-Lc12, Ld1-Ld12, Le1-Le12, and Lf1-Lf12) may be configured togenerate at least 20 lumens per square millimeter of the optic areawhile delivering at least 100 lumens per watt of power consumed by theplurality of light emitting diodes between the continuous opticalcoating and the submount while delivering at least 600 absolute lumensfrom the plurality of light emitting diodes between the continuousoptical element (e.g., phosphor layer) and the submount. Moreparticularly, the LEDs on the submount may be configured to generate atleast 25 lumens per square millimeter of the optic area while deliveringat least 100 lumens per watt of power consumed. According to someembodiments, the optic area may be in the range of about 20 squaremillimeters to about 200 square millimeters.

Each LED of FIGS. 30B and 30C (e.g., LEDs La1-La12, Lb1-Lb12, Lc1-Lc12,Ld1-Ld12, Le1-Le12, and Lf1-Lf12) may have a structure as discussedabove, for example, with respect to FIGS. 1 and 2. Each LED, forexample, may include a diode region having first and second opposingfaces including therein an n-type layer and a p-type layer, an anodecontact that ohmically contacts the p-type layer and extends on thefirst face, and a cathode contact that ohmically contacts the n-typelayer and extends on the first face. In addition, a support substratemay be provided on the second face of the diode region, with the dioderegion being between the support substrate and the anode and cathodecontacts, and with the support substrate having a thickness of at leastabout 50 micrometers. The support substrate, for example, may be aportion of an epitaxial growth substrate remaining after dicing the LEDfrom a processing wafer so that the support substrate and the dioderegion have aligned crystal structures. According to some otherembodiments, the support substrate may be bonded to the diode regionafter removing the diode region from a growth substrate. Once the LED isassembled on the submount as shown in FIGS. 30B and 30C, the dioderegion may thus be between the support substrate and the packagingsubstrate.

Each LED (e.g., each of LEDs La1-La12, Lb1-Lb12, Lc1-Lc12, Ld1-Ld12,Le1-Le12, and Lf1-Lf12) may be mechanically and electrically coupled torespective interconnection islands 2905, positive electrical contact2901, and/or negative electrical contact 2903 using first and secondmetallic (e.g., solder) bonds located physically between the LED and thesubmount as discussed above, for example, with respect to FIGS. 1 and/or2. More particularly, each LED may include an anode contact electricallyand mechanically coupled to one of interconnection islands 2905,positive electrical contact 2901, and/or negative electrical contact2903 using a first metallic bond physically located between the anodecontact and the submount. Similarly, each LED may include a cathodecontact electrically and mechanically coupled to another ofinterconnection islands 2905, positive electrical contact 2901, and/ornegative electrical contact 2903 using a second metallic bond physicallylocated between the cathode contact and the submount. Accordingly, LEDsmay be assembled on the submount of FIGS. 29A-E and 30A-C withoutwirebonding. Adjacent LEDs of the array illustrated in FIGS. 30B and 30Cmay thus be spaced apart by a distance in the range of about 20micrometers to about 500 micrometers.

At 6 watts and 85 degrees C., the LED assembly of FIG. 30B may provide aflux output (at a color temperature of about 3,000K) in the range ofabout 625 lumens to about 675 lumens, thereby providing an efficacy inthe range of 100 lumens/watt to about 110 lumens/watt. At 15 watts and85 degrees C., the LED assembly of FIG. 30B may provide a flux output(at a color temperature of about 3,000K) in the range of about 1250lumens to about 1350 lumens, thereby providing an efficacy in the rangeof 83 lumens/watt to about 90 lumens/watt. At 25 degrees C., theassembly may provide greater than 125 lumens per watt (at a colortemperature of 3000K). The LED assembly may be available over a fullrange of color temperatures from 2700K to 5000K (e.g., 2700K, 3000K,3500K, 4000K, or 5000K) and with options for minimum CRIs of 80, 85, or90. A viewing angle of 120 degrees may be provided with submountdimensions of 9 mm by 9 mm, and with an optical source (e.g., lens)having a diameter of 8 mm. Moreover, easywhite 4 and 2 step binning maybe available, and lifetimes greater than 50,000 hours may be available.

FIGS. 31A, 31B, and 31C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments of thepresent invention. FIG. 31D is a enlarged cross sectional view of thesubmount of FIGS. 31A, 31B, and 31C illustrating dimensions of top sideand bottom side metallizations, and FIG. 31E is a table providing alegend of materials and dimensions. A patterned metallization (e.g.,including electroless copper on titanium and/or gold) on the top side ofthe submount may provide a positive electrical contact 3101, a negativeelectrical contact 3103, and an interconnection structure 3105.Moreover, electrically insulating gap(s) 3107 may separate the positiveelectrical contact 2901, the negative electrical contact 2903, and theinterconnection structure 3105. By providing an optically reflectivesurface of the metallization and by providing a reflective material(e.g., white solder mask) in the electrically insulating gap(s) 3107, alight output of the assembled device may be improved.

Moreover, electrically conductive via holes 3119 may provide electricalcoupling between positive and negative electrical contacts 3101 and 3103on the submount top side and respective positive and negative electricalcontacts 3121 and 3123 on the submount bottom side. Backside electricalcontacts 3121 and 3123 may thus be soldered to a next level packagingsubstrate (e.g., a printed circuit board or PCB) to provide electricaland mechanical coupling between the submount and the next levelpackaging substrate without requiring wirebonds. In addition, thermallyconductive pad 3125 may be provided on the backside of the submountbetween backside electrical contacts 3121 and 3123, and thermallyconductive pad 3125 may be soldered to the next level packagingsubstrate to increase thermal coupling between the submount and the nextlevel packaging substrate. Use of thermally conductive pad 3125 on athermally conductive but electrically insulating submount substrate(e.g., an aluminum nitride substrate) may thus increase conduction ofheat away from light emitting diodes on the front side of the submount.More particularly, backside electrical contacts 3121 and 3123 andthermally conductive pad 3125 may be patterned from a same layer of asame electrically and thermally conductive material(s) (e.g., one ormore layers of metals and/or metal alloys) so that electricallyconductive gaps 3127 are provided therebetween. More particularly, backside electrical contacts 3121 and 3123 and thermally conductive pad 3125may be patterned from a metallization including electroless copper ontitanium and/or gold. Thermally conductive pad 3125 may thus beelectrically isolated from electrical contact 3121, electrical contact3123, positive electrical contact 3101, negative electrical contact3103, and/or interconnection islands.

FIG. 32A is an enlarged view of the top side of the submount of FIG.31A, and FIG. 32B is an enlarged view of the top side of the submount ofFIG. 31A populated with 36 LEDs electrically coupled in parallel betweenpositive electrical contact 3101 and interconnection structure 3105 (inthe upper half of the figure) and with 36 LEDs electrically coupled inparallel between interconnection structure 3105 and negative electricalcontact 3103. FIG. 32C is a greatly enlarged view of a central portionof the submount of FIGS. 31A-E and 32A-B including the LEDs (e.g., LEDsLA1 to La36 and Lb1 to Lb36). The two groups of parallel LEDs (e.g.,LEDs LA1 to La36 electrically coupled in parallel between positiveelectrical contact 3101 and interconnection structure 3105 and LEDs Lb1to Lb36 electrically coupled in parallel between interconnectionstructure 3105 and negative electrical contact 3103) are electricallycoupled in series between positive and negative electrical contacts 3101and 3103 because the two portions of the interconnection structure 3105are electrically coupled through the center of the submount and throughthe center of the LED array as indicated by reference numbers 3111 ofFIGS. 32A and 32C. Seventy two LEDs may thus be provided within asubstantially circular area having a diameter of less than about 6 mm,and more particularly, less than about 5 mm, and still moreparticularly, less than about 4.5 mm. Moreover, each LED may have aforward voltage drop of about 3 volts so that each group of parallelLEDs may has a voltage drop of about 3 volts and so that the lightingdevice may have an operating voltage of about 6 volts. Moreover, alayout of the LEDs may be symmetrical above and below a horizontal linethrough the center of the array.

As shown more clearly in FIGS. 32A and 32C, the gaps 3107 of FIG. 31Amay include two gaps 3107′ and 3107″. Gap 3107′ may separate positiveelectrical contact 3101 from interconnection structure 3105, gap 3107″may separate interconnection structure 3015 from negative electricalcontact 3103, and upper and lower portions of interconnection structure3105 may be electrically connected between gaps 3107′ and 3107″ asindicated by reference numeral 3111. To increase light output, positiveelectrical contact 3101, negative electrical contact 3103, andinterconnection structure 3105 may be patterned from a same layer(s) ofa reflective metal(s) and/or metal alloy(s) (e.g., a metallizationincluding electroless copper on titanium and/or gold), and insulatinggaps 3107′ and 3107″ may be electrically insulating and reflective.

In the structure of FIGS. 31A-E and 32A-C, a first group of thirty sixLEDs La1-La36 may be electrically coupled in parallel, and a secondgroup of thirty six LEDs Lb1-Lb36 may be electrically coupled inparallel, and each LED may have a forward voltage drop in the range ofabout 2.5 volts to about 3.5 volts. With forward voltage drops of about3 volts for each of the LEDs, for example, the device of FIGS. 31A-E and32A-C may operate with a potential of six volts applied across positiveand negative electrical contacts 3101 and 3103. Moreover, the parallelarrangement of LEDs provides redundancy so that operation of the devicemay be maintained even if one or more of the LEDs fails. Stated in otherwords, interconnection structure 3105 may act as a common node betweenthe two groups of LEDs so that failure of any one of the LEDs will notblock current through any of the other LEDs. In addition, the seventytwo LEDs in the structure of FIGS. 31A-E and 32A-C may be providedwithin a substantially circular area having a diameter of less thanabout 6 mm, and more particularly, less than about 5 mm, and still moreparticularly, less than about 4.5 mm.

In addition, a dam (illustrated by the dashed circle 3195 of FIG. 32A)may surround the array of LEDs as discussed above with respect to dam195 of FIG. 20, and the dam 3195 may be used to confine a phosphor layerthat may be dispensed as a liquid therein and then solidified. Thephosphor layer may thus define a continuous optical coating on theplurality of LEDs and on the submount so that the LEDs are between theoptical coating and the submount. More particularly, the phosphor layermay include a layer of a transparent and/or translucent materialincluding a phosphor material (e.g., a yellow phosphor that convertsblue light to yellow light) therein. Blue emitting LEDs may thus beassembled on the submount with a yellow phosphor layer provided thereonso that a blue shifted yellow light output is generated. According tosome other embodiments, the phosphor layer may include first and seconddifferent phosphor materials configured to emit different wavelengths oflight responsive to light generated by the assembled LEDs.

According to still other embodiments, the phosphor layer may includefirst, second, and third different phosphor materials configured to emitrespective first, second, and third different wavelengths of lightresponsive to light generated by the assembled LEDs. For example, theassembled LEDs may generate blue light, and the phosphor layer mayinclude a binder, a first phosphor (e.g., an aluminum garnet-basedphosphor) that is configured to down-convert blue light to radiationhaving a peak wavelength in the green color range that has a full widthhalf maximum bandwidth that extends into the cyan color range, a secondphosphor (e.g., an aluminum garnet-based phosphor) that is configured todown-convert blue light to radiation having a peak wavelength in theyellow color range, and a third phosphor (e.g., a nitride-based and/oroxynitride-based phosphor) that is configured to down-convert blue lightto radiation having a peak wavelength in the red color range. Threephosphor systems are discussed, for example, in U.S. Patent PublicationNo. 2011/0220929, to Collins et al., entitled Warm White LEDs HavingHigh Color Rendering Index Values And Related Luminophoric Mediums,assigned to the assignee of the present application, the entiredisclosure of which is hereby incorporated by reference as if set forthfully herein (hereinafter referred to as “the '929 Publication”).

In addition, a thickness of the continuous optical coating may begreater than a thickness of each of the LEDs relative to the top surfaceof the submount, and a surface of the continuous optical coatingopposite the submount may be substantially planar over the areaincluding the LEDs. While a planar phosphor layer may be used asdiscussed above, other optical elements may be used on LEDs for thesubmounts of FIGS. 31A-E and 32A-C such as a conformal phosphor layer(s)as discussed above with respect to FIG. 18 and/or a convex lenselement(s) as discussed above with respect to FIG. 19.

Moreover, an optic area may be defined by an area of the submountcovered by the continuous optical coating (e.g., an area of the submountwithin dam 3195, and/or an area of the submount covered by a convex lenselement), and the LEDs on the submount (e.g., LEDs La1-La36 andLb1-Lb36) may be configured to generate at least 20 lumens per squaremillimeter of the optic area while delivering at least 100 lumens perwatt of power consumed by the plurality of light emitting diodes betweenthe continuous optical coating and the submount while delivering atleast 600 absolute lumens from the plurality of light emitting diodesbetween the continuous optical element (e.g., phosphor layer) and thesubmount. More particularly, the LEDs on the submount may be configuredto generate at least 25 lumens per square millimeter of the optic areawhile delivering at least 100 lumens per watt of power consumed.According to some embodiments, the optic area may be in the range ofabout 20 square millimeters to about 200 square millimeters.

Each LED of FIGS. 32B and 32C (e.g., LEDs La1-La36 and Lb1-Lb36) mayhave a structure as discussed above, for example, with respect to FIGS.1 and 2. Each LED, for example, may include a diode region having firstand second opposing faces including therein an n-type layer and a p-typelayer, an anode contact that ohmically contacts the p-type layer andextends on the first face, and a cathode contact that ohmically contactsthe n-type layer and extends on the first face. In addition, a supportsubstrate may be provided on the second face of the diode region, withthe diode region being between the support substrate and the anode andcathode contacts, and with the support substrate having a thickness ofat least about 50 micrometers. The support substrate, for example, maybe a portion of an epitaxial growth substrate remaining after dicing theLED from a processing wafer so that the support substrate and the dioderegion have aligned crystal structures. According to some otherembodiments, the support substrate may be bonded to the diode regionafter removing the diode region from a growth substrate. Once the LED isassembled on the submount as shown in FIGS. 32B and 32C, the dioderegion may thus be between the support substrate and the packagingsubstrate.

Each LED (e.g., each of LEDs La1-La36 and Lb1-Lb36) may be mechanicallyand electrically coupled between positive electrical contact 3101 andinterconnection structure 3105 or between interconnection structure 3105and negative electrical contact 3103 using first and second metallic(e.g., solder) bonds located physically between the LED and the submountas discussed above, for example, with respect to FIGS. 1 and/or 2. Moreparticularly, each LED may include an anode contact electrically andmechanically coupled to one of positive electrical contact 3101,interconnection structure 3105, or negative electrical contact 3103using a first metallic bond physically located between the anode contactand the submount. Similarly, each LED may include a cathode contactelectrically and mechanically coupled to another of positive electricalcontact 3101, interconnection structure 3105, or negative electricalcontact 3103 using a second metallic bond physically located between thecathode contact and the submount. Accordingly, LEDs may be assembled onthe submount of FIGS. 31A-E and 32A-C without wirebonding. Adjacent LEDsof the array illustrated in FIGS. 32B and 32C may thus be spaced apartby a distance in the range of about 20 micrometers to about 500micrometers.

At 6 watts and 85 degrees C., the LED assembly of FIG. 32B may provide aflux output (at a color temperature of about 3,000K) in the range ofabout 625 lumens to about 675 lumens, thereby providing an efficacy inthe range of 100 lumens/watt to about 110 lumens/watt. At 15 watts and85 degrees C., the LED assembly of FIG. 32B may provide a flux output(at a color temperature of about 3,000K) in the range of about 1250lumens to about 1350 lumens, thereby providing an efficacy in the rangeof 83 lumens/watt to about 90 lumens/watt. At 25 degrees C., theassembly may provide greater than 125 lumens per watt (at a colortemperature of 3000K). The LED assembly may be available over a fullrange of color temperatures from 2700K to 5000K (e.g., 2700K, 3000K,3500K, 4000K, or 5000K) and with options for minimum CRIs of 80, 85, or90. A viewing angle of 120 degrees may be provided with submountdimensions of 9 mm by 9 mm, and with an optical source (e.g., lens)having a diameter of 8 mm. Moreover, easywhite 4 and 2 step binning maybe available, and lifetimes greater than 50,000 hours may be available.

FIGS. 33A, 33B, and 33C, are respective top side, edge, and bottom sideviews of an LED (light emitting diode) packaging submount (withdimensions shown in mm) according to additional embodiments of thepresent invention. FIG. 33D is an enlarged cross sectional view of thesubmount of FIGS. 33A, 33B, and 33C illustrating dimensions of top sideand bottom side metallizations, and FIG. 33E is a table providing alegend of materials and dimensions. A patterned metallization (e.g.,including electroless copper on titanium and/or gold) on the top side ofthe submount may provide a positive electrical contact 3301, a negativeelectrical contact 3303, and interconnection islands 3305. Moreover,electrically insulating gap 3307 may separate the positive electricalcontact 3301, the negative electrical contact 3303, and theinterconnection islands 3305. By providing an optically reflectivesurface of the metallization and by providing a reflective material(e.g., white solder mask) in the electrically insulating gaps, a lightoutput of the assembled device may be improved.

Moreover, electrically conductive via holes 3319 may provide electricalcoupling between positive and negative electrical contacts 3301 and 3303on the submount top side and respective electrical contacts 3321 and3323 on the submount bottom side. Backside electrical contacts 3321 and323 may thus be soldered to a larger packaging substrate (e.g., aprinted circuit board or PCB) to provide electrical and mechanicalcoupling between the submount and next level packaging substrate withoutrequiring wirebonds. In addition, thermally conductive pad 3325 may beprovided on the backside of the submount between backside electricalcontacts 3321 and 3323, and thermally conductive pad 3325 may besoldered to the larger packaging substrate to increase thermal couplingbetween the submount and next level packaging substrate. Use ofthermally conductive pad 3325 on a thermally conductive but electricallyinsulating submount substrate (e.g., an aluminum nitride substrate) maythus increase conduction of heat away from light emitting diodes on thefront side of the submount. More particularly, backside electricalcontacts 3321 and 3323 and thermally conductive pad 3325 may bepatterned from a same layer of a same electrically and thermallyconductive material(s) (e.g., one or more layers of metals and/or metalalloys) so that electrically conductive gaps 3327 are providedtherebetween. More particularly, back side electrical contacts 3321 and3323 and thermally conductive pad 3325 may be patterned from ametallization including electroless copper on titanium and/or gold.Thermally conductive pad 3325 may thus be electrically isolated fromelectrical contact 3321, electrical contact 3323, positive electricalcontact 3301, negative electrical contact 3303, and/or interconnectionislands.

FIG. 34A is an enlarged view of the top side of the submount of FIG.33A, FIG. 34B illustrates the submount of FIGS. 33A-33E populated with108 LEDs, and FIG. 34C is a greatly enlarged view of a central sectionof the submount illustrating the 108 LEDs. More particularly, the 108LEDs may be arranged in strings of 12 serially coupled LEDs (e.g., LEDsLa1-La12, LEDs Lb1-Lb12, LEDs Lc1-Lc12, LEDs Ld1-Ld12, LEDs Le1-Le12,LEDs Lf1-Lf12, LEDs Lg1-Lg12, LEDs Lh1-Lh12, and LEDs Li1-Li12) with the9 serially coupled strings being arranged in parallel between positiveand negative electrical contacts 3301 and 3303. Each LED may have aforward voltage drop in the range of about 2.5 volts to about 3.5 volts.With forward voltage drops of about 3 volts, for example, each string of12 serially coupled LEDs may have a forward voltage drop of about 36volts to provide a 36 volt operating voltage for the device of FIGS.33A-E and 34A-C. One hundred eight LEDs may thus be provided within asubstantially circular area having a diameter of less than about 9 mm,and more particularly, less than about 8 mm, and still moreparticularly, less than about 6.5 mm. Moreover, a layout of the LEDs maybe symmetrical above and below a horizontal line through the center ofthe array. In embodiments of FIGS. 33A-E and 34A-C, a phosphor layer maybe provided on the LEDs as discussed above with respect to FIG. 18 orFIG. 20 without providing a lens. While not shown in FIGS. 33A-E and34A-C, one or more additional gaps may extend from interconnectionislands 3305 to a perimeter of the metallization as discussed above withrespect to FIGS. 29A-E and 30A-C to provide increased electricalseparation between positive and negative electrical contacts 3301 and3303 while maintaining a substantially circular reflective surfacesurrounding the LEDs that are assembled on the submount.

As shown in FIG. 34B, the 9 strings of LEDs may be electrically coupledin parallel between positive and negative contacts 3301 and 3303. Eachof the lines CP-1 to CP-9 represents a current path from positiveelectrical contact 3301 through a respective string of twelve LEDs tonegative electrical contact 3303. Moreover, each LED may have a forwardvoltage drop in the range of about 2.5 volts to about 3.5 volts. Moreparticularly, each LED may have a forward voltage drop of about 3 voltsso that each string of 12 LEDs has a voltage drop of about 36 volts toprovide a lighting device having an operating voltage of about 36 volts.Moreover, a layout of the LEDs may be symmetrical above and below ahorizontal line through the center of the array.

In addition, a dam (illustrated by the dashed circle 3395 of FIG. 34A)may surround the array of LEDs as discussed above with respect to dam195 of FIG. 20, and the dam 3395 may be used to confine a phosphor layerthat may be dispensed as a liquid therein and then solidified. Thephosphor layer may thus define a continuous optical coating on theplurality of LEDs and on the submount so that the LEDs are between theoptical coating and the submount. More particularly, the phosphor layermay include a layer of a transparent and/or translucent materialincluding a phosphor material (e.g., a yellow phosphor that convertsblue light to yellow light) therein. Blue emitting LEDs may thus beassembled on the submount with a yellow phosphor layer provided thereonso that a blue shifted yellow light output is generated. According tosome other embodiments, the phosphor layer may include first and seconddifferent phosphor materials configured to emit different wavelengths oflight responsive to light generated by the assembled LEDs.

According to still other embodiments, the phosphor layer may includefirst, second, and third different phosphor materials configured to emitrespective first, second, and third different wavelengths of lightresponsive to light generated by the assembled LEDs. For example, theassembled LEDs may generate blue light, and the phosphor layer mayinclude a binder, a first phosphor (e.g., an aluminum garnet-basedphosphor) that is configured to down-convert blue light to radiationhaving a peak wavelength in the green color range that has a full widthhalf maximum bandwidth that extends into the cyan color range, a secondphosphor (e.g., an aluminum garnet-based phosphor) that is configured todown-convert blue light to radiation having a peak wavelength in theyellow color range, and a third phosphor (e.g., a nitride-based and/oroxynitride-based phosphor) that is configured to down-convert blue lightto radiation having a peak wavelength in the red color range. Threephosphor systems are discussed, for example, in U.S. Patent PublicationNo. 2011/0220929, to Collins et al., entitled Warm White LEDs HavingHigh Color Rendering Index Values And Related Luminophoric Mediums,assigned to the assignee of the present application, the entiredisclosure of which is hereby incorporated by reference as if set forthfully herein (hereinafter referred to as “the '929 Publication”).

In addition, a thickness of the continuous optical coating may begreater than a thickness of each of the LEDs relative to the top surfaceof the submount, and a surface of the continuous optical coatingopposite the submount may be substantially planar over the areaincluding the LEDs. While a planar phosphor layer may be used asdiscussed above, other optical elements may be used on LEDs for thesubmounts of FIGS. 33A-E and 34A-C such as a conformal phosphor layer(s)as discussed above with respect to FIG. 18 and/or a convex lenselement(s) as discussed above with respect to FIG. 19.

Moreover, an optic area may be defined by an area of the submountcovered by the continuous optical coating (e.g., an area of the submountwithin dam 3395, and/or an area of the submount covered by a convex lenselement), and the LEDs on the submount (e.g., LEDs La1-La12, Lb1-Lb12,Lc1-Lc12, Ld1-Ld12, Le1-Le12, Lf1-Lf12, Lg1-Lg12, Lh1-Lh12, andLi1-Li12) may be configured to generate at least 20 lumens per squaremillimeter of the optic area while delivering at least 100 lumens perwatt of power consumed by the plurality of light emitting diodes betweenthe continuous optical coating and the submount while delivering atleast 600 absolute lumens from the plurality of light emitting diodesbetween the continuous optical element (e.g., phosphor layer) thesubmount. More particularly, the LEDs on the submount may be configuredto generate at least 25 lumens per square millimeter of the optical areawhile delivering at least 100 lumens per watt of power consumed.According to some embodiments, the optic area may be in the range ofabout 20 square millimeters to about 200 square millimeters.

Each LED of FIGS. 34B and 34C (e.g., LEDs La1-La12, Lb1-Lb12, Lc1-Lc12,Ld1-Ld12, Le1-Le12, Lf1-Lf12, Lg1-Lg12, Lh1-Lh12, and Li1-Li12) may havea structure as discussed above, for example, with respect to FIGS. 1 and2. Each LED, for example, may include a diode region having first andsecond opposing faces including therein an n-type layer and a p-typelayer, an anode contact that ohmically contacts the p-type layer andextends on the first face, and a cathode contact that ohmically contactsthe n-type layer and extends on the first face. In addition, a supportsubstrate may be provided on the second face of the diode region, withthe diode region being between the support substrate and the anode andcathode contacts, and with the support substrate having a thickness ofat least about 50 micrometers. The support substrate, for example, maybe a portion of an epitaxial growth substrate remaining after dicing theLED from a processing wafer so that the support substrate and the dioderegion have aligned crystal structures. According to some otherembodiments, the support substrate may be bonded to the diode regionafter removing the diode region from a growth substrate. Once the LED isassembled on the submount as shown in FIGS. 34B and 34C, the dioderegion may thus be between the support substrate and the packagingsubstrate.

Each LED (e.g., each of LEDs La1-La12, Lb1-Lb12, Lc1-Lc12, Ld1-Ld12,Le1-Le12, Lf1-Lf12, Lg1-Lg12, Lh1-Lh12, and Li1-Li12) may bemechanically and electrically coupled to respective interconnectionislands 3305, positive electrical contact 3301, and/or negativeelectrical contact 3303 using first and second metallic (e.g., solder)bonds located physically between the LED and the submount as discussedabove, for example, with respect to FIGS. 1 and/or 2. More particularly,each LED may include an anode contact electrically and mechanicallycoupled to one of interconnection islands 3305, positive electricalcontact 3301, and/or negative electrical contact 3303 using a firstmetallic bond physically located between the anode contact and thesubmount. Similarly, each LED may include an cathode contactelectrically and mechanically coupled to another of interconnectionislands 3305, positive electrical contact 3301, and/or negativeelectrical contact 3303 using a second metallic bond physically locatedbetween the cathode contact and the submount. Accordingly, LEDs may beassembled on the submount of FIGS. 33A-E and 34A-C without wirebonding.Adjacent LEDs of the array illustrated in FIGS. 34B and 34C may thus bespaced apart by a distance in the range of about 20 micrometers to about500 micrometers.

As discussed above with respect to FIGS. 31A-E and 32A-C, a first groupof thirty six LEDs La1 to La36 may be electrically coupled in parallelbetween positive electrical contact 3101 and interconnection structure3105, and a second group of thirty six LEDs Lb1 to Lb36 may beelectrically coupled in parallel between interconnection structure 3105and negative electrical contact 3103. More particularly, this electricalarrangement of LEDs is schematically illustrated in the diagram of FIG.35. With each LED having a forward voltage drop of about three volts,for example, a voltage difference of about six volts may be applied topositive and negative electrical contacts 3101 and 3103 to drive thedevice, and a voltage of interconnection structure 3105 may be about 3volts less than a voltage of positive electrical contact 3101 and about3 volts higher than a voltage of negative electrical contact 3103. Byproviding interconnection structure 3105 as a common node as shown inFIG. 35, any one of the LEDs may fail without blocking current throughany of the other LEDs. Stated in other words, the structure of FIGS.31A-E and 32A-C may provide redundancy relative to a similar electricalstructure without interconnection structure 3105. Similarinterconnection structures may be applied to other devices includingparallel LED structures to provide similar redundancies withoutsignificantly changing operation of the devices.

FIG. 36A, for example, is a schematic diagram illustrating electricalcouplings of LEDs La1 to La12, Lb1 to Lb12, Lc1 to Lc12, Ld1 to Ld12,Le1 to Le12, and Lf1 to Lf12 of FIGS. 29A-29E and 30A-30C. In thestructure of FIGS. 29A-29E, 30A-30C, and 36A, failure of one LED in astring of serially coupled LEDs may result in a loss of the entirestring of 12 LEDs, potentially reducing light output by one sixth. Asshown in FIGS. 36B, 36C, and 36D, the submount structure of FIGS.29A-29E, 30A-30C, and 36A may be modified to include interconnectionstructures to provide redundancy as discussed above with respect toFIGS. 31A-E, 32A-C, and 35.

As shown in FIG. 36B, for example, a single interconnection structure2965 may be provided to interconnect central nodes of each of the LEDstrings. Accordingly, failure of any one LED may only result in loss ofa string of six LEDs. As shown in FIG. 36C, five interconnectionstructures 2965 c may be provided so that an interconnection structureis provided for every two LEDs of the strings of LEDs. Accordingly,failure of any one LED may result in loss of only one other LED. Asshown in FIG. 36D, eleven interconnection structures 2965 d may beprovided so that an interconnection structure is provided for each LEDof the strings of LEDs. Accordingly, failure of any one LED will notblock operation of any other LEDs.

The interconnection structures 2965 b, 2965 c, and 2965 d of FIGS. 36B,36C, and 36D may be provided by electrically coupling respective ones ofinterconnection islands 2905 of FIGS. 29A, 30A, and 30C. By way ofexample, interconnection islands, interconnection structures, andpositive and negative electrical contacts may be patterned from a samemetallization layer. According to other embodiments, an interconnectionstructure(s) may be provided using another metallization layer(s) onanother plane(s) of the submount with electrically conductive viasproviding electrical coupling between the interconnection structure(s)and respective interconnection islands. Interconnection structure 2965 bof FIG. 36B, for example, may provide electrical coupling between theinterconnections islands electrically coupled between LEDs La6 and La1,between LEDs Lb6 and Lb7, between LEDs Lc6 and Lc7, between LEDs Ld6 andLd7, between LEDs Le6 and Le7, and between LEDs Lf6 and Lf7.

Interconnection structures 3105, 2965 b, 2965 c, and 2965 d of FIGS. 35,36B, 36C, and 36D may thus provide serial/parallel couplings instructures of closely packaged LEDs mounted on submounts withoutwirebonds. Similar interconnection structures may also be applied tosubmount structures of FIGS. 33A-33E and 34A-34C.

Many different embodiments have been disclosed herein, in connectionwith the above description and the drawings. It will be understood thatit would be unduly repetitious and obfuscating to literally describe andillustrate every combination and subcombination of these embodiments.Accordingly, the present specification, including the drawings, shall beconstrued to constitute a complete written description of allcombinations and subcombinations of the embodiments described herein,and of the manner and process of making and using them, and shallsupport claims to any such combination or subcombination.

In the drawings and specification, there have been disclosed embodimentsof the invention and, although specific terms are employed, they areused in a generic and descriptive sense only and not for purposes oflimitation, the scope of the invention being set forth in the followingclaims.

That which is claimed is:
 1. An electronic device comprising: apackaging substrate having a packaging face, the packaging substrateincluding positive and negative electrically conductive pads on thepackaging face; a plurality of light emitting diodes electrically andmechanically coupled to the packaging face of the packaging substrate,wherein the plurality of light emitting diodes are electrically coupledbetween the positive and negative electrically conductive pads on thepackaging face; and a continuous optical coating on the plurality oflight emitting diodes and on the packaging face of the packagingsubstrate so that the plurality of light emitting diodes are between theoptical coating and the packaging substrate, wherein an optic area isdefined by an area of the packaging face covered by the continuousoptical coating, and wherein the plurality of light emitting diodes areconfigured to generate at least 20 lumens per square millimeter of theoptic area while delivering at least 100 lumens per watt of powerconsumed by the plurality of light emitting diodes between thecontinuous optical coating and the packaging substrate.
 2. Theelectronic device of claim 1 wherein the plurality of light emittingdiodes are configured to generate at least 25 lumens per squaremillimeter of the optic area while delivering at least 100 lumens perwatt of power consumed.
 3. The electronic device of claim 1 wherein theplurality of light emitting diodes comprises at least 16 light emittingdiodes between the continuous optical coating and the packagingsubstrate.
 4. The electronic device of claim 3 wherein the plurality oflight emitting diodes comprises at least 72 light emitting diodes. 5.The electronic device of claim 1 wherein at least one of the lightemitting diodes is free of wirebonds.
 6. The electronic device of claim1 wherein at least one of the light emitting diodes comprises an anodecontact electrically and mechanically coupled to the packaging substrateusing a first metallic bond physically located between the anode contactand the packaging substrate and a cathode contact electrically andmechanically coupled to the packaging substrate using a second metallicbond physically located between the cathode contact and the packagingsubstrate.
 7. The electronic device of claim 1 wherein each of theplurality of light emitting diodes comprises, a diode region havingfirst and second opposing faces including therein an n-type layer and ap-type layer, an anode contact that ohmically contacts the p-type layerand extends on the first face, a cathode contact that ohmically contactsthe n-type layer and extends on the first face, and a support substrateon the second face of the diode region, wherein the diode region isbetween the support substrate and the anode and cathode contacts, andwherein the support substrate has a thickness of at least about 50micrometers.
 8. The electronic device of claim 7 wherein for each of theplurality of light emitting diodes, the diode region is between thesupport substrate and the packaging substrate, a phosphor layer iscoated on the support substrate, and the packaging substrate is free ofwirebonds electrically coupled between the packaging substrate and thelight emitting diode.
 9. The electronic device of claim 1 wherein thecontinuous optical coating comprises a layer of a transparent and/ortranslucent material including a phosphor material therein.
 10. Theelectronic device of claim 9 wherein a thickness of the continuousoptical coating relative to the packaging face of the packagingsubstrate is greater than a thickness of each of the plurality of lightemitting diodes relative to the packaging face of the packagingsubstrate, and wherein a surface of the continuous optical coatingopposite the packaging substrate is substantially planar over an areaincluding the plurality of light emitting diodes.
 11. The electronicdevice of claim 1 wherein the optic area is in the range of about 20square millimeters to about 200 square millimeters.
 12. The electronicdevice of claim 1 wherein the packaging substrate has a backside faceopposite the packaging face, the packaging substrate further comprisinga first backside contact electrically coupled to the positiveelectrically conductive pad through a first electrically conductive viathrough the packaging substrate, and a second backside contactelectrically coupled to the negative electrically conductive pad througha second electrically conductive via through the packaging substrate.13. The electronic device of claim 12 wherein the packaging substratecomprises an aluminum nitride substrate, and a metal heat conductingstructure on the backside face wherein the metal heat conductingstructure is electrically isolated from the first and second backsidecontacts, and wherein the metal heat conducting structure is alignedwith the plurality of light emitting diodes in a direction perpendicularwith respect to the packaging face of the packaging substrate.
 14. Theelectronic device of claim 1 wherein the plurality of light emittingdiodes comprises a first string of light emitting diodes electricallycoupled in series between the positive and negative electricallyconductive pads, and a second string of light emitting diodeselectrically coupled in series between the positive and negativeelectrically conductive pads, wherein a node between two light emittingdiodes of the first string is electrically coupled to a node between twolight emitting diodes of the second string, and wherein at least one ofthe plurality of light emitting diodes is electrically coupled to thepackaging substrate using no more than one wirebond.
 15. The electronicdevice of claim 1 wherein the continuous optical coating comprises alayer of a transparent and/or translucent material including multipledifferent phosphor materials therein, wherein each of the differentphosphor materials is configured to emit a respective differentwavelength of light responsive to light generated by the plurality oflight emitting diodes.
 16. The electronic device of claim 1 wherein theplurality of light emitting diodes are configured to generate at least20 lumens per square millimeter of the optic area while delivering atleast 100 lumens per watt of power consumed by the plurality of lightemitting diodes between the continuous optical coating and the packagingsubstrate and while delivering at least 600 absolute lumens from theplurality of light emitting diodes between the continuous opticalcoating and the packaging substrate.
 17. The electronic device of claim1 wherein the plurality of light emitting diodes comprises first andsecond light emitting diodes between the continuous optical coating andthe packaging substrate wherein the first and second light emittingdiodes are spaced apart by a distance in the range of about 20micrometers to about 500 micrometers.
 18. An electronic devicecomprising: a packaging substrate having a packaging face, the packagingsubstrate including positive and negative electrically conductive padson the packaging face; a plurality of light emitting diodes electricallyand mechanically coupled to the packaging face of the packagingsubstrate, wherein the plurality of light emitting diodes areelectrically coupled between the positive and negative electricallyconductive pads on the packaging face; and a continuous optical coatingon the plurality of light emitting diodes and on the packaging face ofthe packaging substrate so that the plurality of light emitting diodesare between the optical coating and the packaging substrate, wherein athickness of the continuous optical coating relative to the packagingface of the packaging substrate is greater than a thickness of each ofthe plurality of light emitting diodes relative to the packaging face ofthe packaging substrate, wherein a surface of the continuous opticalcoating opposite the packaging substrate is substantially planar over anarea including the plurality of light emitting diodes, and wherein atleast one of the plurality of light emitting diodes is free ofwirebonds.
 19. The electronic device of claim 18 wherein an optic areais defined by an area of the packaging face covered by the continuousoptical coating, and wherein the plurality of light emitting diodes areconfigured to generate at least 20 lumens per square millimeter of theoptic area while delivering at least 100 lumens per watt of powerconsumed by the plurality of light emitting diodes between thecontinuous optical coating and the packaging substrate.
 20. Theelectronic device of claim 18 wherein the plurality of light emittingdiodes comprises at least 16 light emitting diodes between thecontinuous optical coating and the packaging substrate.
 21. Theelectronic device of claim 20 wherein the plurality of light emittingdiodes comprises at least 72 light emitting diodes.
 22. The electronicdevice of claim 18 wherein at least one of the light emitting diodescomprises an anode contact electrically and mechanically coupled to thepackaging substrate using a first metallic bond located between theanode contact and the packaging substrate and a cathode contactelectrically and mechanically coupled to the packaging substrate using asecond metallic bond located between the cathode contact and thepackaging substrate.
 23. The electronic device of claim 18 wherein eachof the plurality of light emitting diodes comprises, a diode regionhaving first and second opposing faces including therein an n-type layerand a p-type layer, an anode contact that ohmically contacts the p-typelayer and extends on the first face, a cathode contact that ohmicallycontacts the n-type layer and extends on the first face, and a supportsubstrate on the second face of the diode region, wherein the dioderegion is between the support substrate and the anode and cathodecontacts, and wherein the support substrate has a thickness of at leastabout 50 micrometers.
 24. The electronic device of claim 23 wherein foreach of the plurality of light emitting diodes, the diode region isbetween the support substrate and the packaging substrate, a phosphorlayer is coated on the support substrate, and the packaging substrate isfree of wirebonds electrically coupled between the packaging substrateand the light emitting diode.
 25. The electronic device of claim 18wherein the continuous optical coating comprises a layer of atransparent and/or translucent material including a phosphor materialtherein.
 26. The electronic device of claim 18 wherein the packagingsubstrate has a backside face opposite the packaging face, the packagingsubstrate further comprising a first backside contact electricallycoupled to the positive electrically conductive pad through a firstelectrically conductive via, and a second backside contact electricallycoupled to the negative electrically conductive pad through a secondelectrically conductive via.
 27. The electronic device of claim 26wherein the packaging substrate comprises a thermally conductive andelectrically insulating material, and a metal heat conducting structureon the backside face wherein the metal heat conducting structure iselectrically isolated from the first and second backside contacts, andwherein the metal heat conducting structure is aligned with theplurality of light emitting diodes in a direction perpendicular withrespect to the packaging face of the packaging substrate.
 28. Theelectronic device of claim 18 wherein the plurality of light emittingdiodes comprises a first string of light emitting diodes electricallycoupled in series between the positive and negative electricallyconductive pads, and a second string of light emitting diodeselectrically coupled in series between the positive and negativeelectrically conductive pads, wherein a node between two light emittingdiodes of the first string is electrically coupled to a node between twolight emitting diodes of the second string, and wherein at least one ofthe plurality of light emitting diodes is free of wirebonds.
 29. Theelectronic device of claim 18 wherein the continuous optical coatingcomprises a layer of a transparent and/or translucent material includingmultiple different phosphor materials therein, wherein each of thedifferent phosphor materials is configured to emit a respectivedifferent wavelength of light responsive to light generated by theplurality of light emitting diodes.
 30. The electronic device of claim18 further comprising: a dam surrounding the plurality of light emittingdiodes, wherein the continuous optical coating is confined within thedam.
 31. An electronic device comprising: a packaging substrate having apackaging face, the packaging substrate including positive and negativeelectrically conductive pads on the packaging face; and a plurality oflight emitting diodes electrically and mechanically coupled to thepackaging face of the packaging substrate, wherein the plurality oflight emitting diodes are electrically coupled between the positive andnegative electrically conductive pads on the packaging face, wherein theplurality of light emitting diodes comprises a first string of lightemitting diodes electrically coupled in series between the positive andnegative electrically conductive pads, and a second string of lightemitting diodes electrically coupled in series between the positive andnegative electrically conductive pads, wherein a node between two lightemitting diodes of the first string is electrically coupled to a nodebetween two light emitting diodes of the second string, and wherein atleast one of the plurality of light emitting diodes is electricallycoupled to the packaging substrate using no more than one wirebond. 32.The electronic device of claim 31 further comprising: a continuousoptical coating on the plurality of light emitting diodes and on thepackaging face of the packaging substrate so that the plurality of lightemitting diodes are between the optical coating and the packagingsubstrate, wherein an optic area is defined by an area of the packagingface covered by the continuous optical coating, and wherein theplurality of light emitting diodes are configured to generate at least20 lumens per square millimeter of the optic area while delivering atleast 100 lumens per watt of power consumed by the plurality of lightemitting diodes between the continuous optical coating and the packagingsubstrate.
 33. The electronic device of claim 31 wherein the pluralityof light emitting diodes comprises at least 16 light emitting diodesbetween the continuous optical coating and the packaging substrate. 34.The electronic device of claim 33 wherein the plurality of lightemitting diodes comprises at least 72 light emitting diodes.
 35. Theelectronic device of claim 31 wherein at least one of the light emittingdiodes is free of wirebonds.
 36. The electronic device of claim 31wherein at least one of the light emitting diodes comprises an anodecontact electrically and mechanically coupled to the packaging substrateusing a first metallic bond physically located between the anode contactand the packaging substrate and a cathode contact electrically andmechanically coupled to the packaging substrate using a second metallicbond physically located between the cathode contact and the packagingsubstrate.
 37. The electronic device of claim 31 wherein each of theplurality of light emitting diodes comprises, a diode region havingfirst and second opposing faces including therein an n-type layer and ap-type layer, an anode contact that ohmically contacts the p-type layerand extends on the first face, a cathode contact that ohmically contactsthe n-type layer and extends on the first face, and a support substrateon the second face of the diode region, wherein the diode region isbetween the support substrate and the anode and cathode contacts, andwherein the support substrate has a thickness of at least about 50micrometers.
 38. The electronic device of claim 37 wherein for each ofthe plurality of light emitting diodes, the diode region is between thesupport substrate and the packaging substrate, a phosphor layer iscoated on the support substrate, and the packaging substrate is free ofwirebonds electrically coupled between the packaging substrate and thelight emitting diode.
 39. The electronic device of claim 31 wherein thecontinuous optical coating comprises a layer of a transparent and/ortranslucent material including a phosphor material therein.
 40. Theelectronic device of claim 39 wherein a thickness of the continuousoptical coating relative to the packaging face of the packagingsubstrate is greater than a thickness of each of the plurality of lightemitting diodes relative to the packaging face of the packagingsubstrate, and wherein a surface of the continuous optical coatingopposite the packaging substrate is substantially planar over an areaincluding the plurality of light emitting diodes.
 41. The electronicdevice of claim 31 wherein the packaging substrate has a backside faceopposite the packaging face, the packaging substrate further comprisinga first backside contact electrically coupled to the positiveelectrically conductive pad through a first electrically conductive viathrough the packaging substrate, and a second backside contactelectrically coupled to the negative electrically conductive pad througha second electrically conductive via through the packaging substrate.42. The electronic device of claim 41 wherein the packaging substratecomprises an aluminum nitride substrate, and a metal heat conductingstructure on the backside face wherein the metal heat conductingstructure is electrically isolated from the first and second backsidecontacts, and wherein the metal heat conducting structure is alignedwith the plurality of light emitting diodes in a direction perpendicularwith respect to the packaging face of the packaging substrate.
 43. Theelectronic device of claim 32 wherein the continuous optical coatingcomprises a layer of a transparent and/or translucent material includingmultiple different phosphor materials therein, wherein each of thedifferent phosphor materials is configured to emit a respectivedifferent wavelength of light responsive to light generated by theplurality of light emitting diodes.
 44. An electronic device comprising:a packaging substrate having a packaging face, the packaging substrateincluding positive and negative electrically conductive pads on thepackaging face; and a plurality of light emitting diodes electricallyand mechanically coupled to the packaging face of the packagingsubstrate, wherein the plurality of light emitting diodes areelectrically coupled between the positive and negative electricallyconductive pads on the packaging face, wherein each of the plurality oflight emitting diodes has a forward voltage drop in the range of about2.5 volts to about 3.5 volts, and wherein the plurality of lightemitting diodes are configured to provide a combined forward voltagedrop between the positive and negative electrically conductive pads ofat least about 36 volts, and wherein at least one of the plurality oflight emitting diodes is free of wirebonds.
 45. An electronic deviceaccording to claim 44 wherein the plurality of light emitting diodescomprises at least 70 light emitting diodes electrically coupled inseries between the positive and negative electrically conductive pads,and wherein the plurality of light emitting diodes are configured toprovide a combined forward voltage drop between the positive andnegative electrically conductive pads of at least about 200 volts. 46.An electronic device according to claim 45 wherein the plurality oflight emitting diodes comprises at least 75 light emitting diodeselectrically coupled in series between the positive and negativeelectrically conductive pads, and wherein the plurality of lightemitting diodes are configured to provide a combined forward voltagedrop between the positive and negative electrically conductive pads ofat least about 220 volts.
 47. An electronic device according to claim 46wherein the packaging substrate comprises a plurality of electricallyconductive islands providing electrical coupling between respective onesof the plurality of light emitting diodes between the positive andnegative electrically conductive pads, wherein the electricallyconductive islands and the positive and negative electrically conductivepads define a reflective area on the packaging substrate surrounding theplurality of light emitting diodes, wherein at least one of theelectrically conductive islands extends to an edge of the reflectivearea adjacent to the one of the positive and/or negative electricallyconductive pads with an electrically insulating gap definedtherebetween.
 48. An electronic device according to claim 47 wherein theat least one of the electrically conductive islands comprise a firstelectrically conductive island, and wherein a second one of theelectrically conductive islands extends to the edge of the reflectivearea adjacent to the first electrically conductive island with anelectrically insulating gap defined between the first and secondelectrically conductive islands.
 49. An electronic device according toclaim 45 wherein the packaging substrate comprises a plurality ofelectrically conductive islands providing electrical coupling betweenrespective ones of the plurality of light emitting diodes between thepositive and negative electrically conductive pads, wherein thepackaging substrate comprises an electrically conductive reflector layeradjacent at least one of the plurality of electrically conductiveislands and adjacent at least one of the positive and/or negativeelectrically conductive pads, wherein the electrically conductiveislands, the electrically conductive reflector, and the positive andnegative electrically conductive pads define a reflective area on thepackaging substrate surrounding the plurality of light emitting diodes,and wherein the electrically conductive reflector is electricallyisolated from each of the positive electrically conductive pad, thenegative electrically conductive pad, and each of the plurality ofelectrically conductive islands.
 50. An electronic device according toclaim 44 wherein at least two light emitting diodes of the plurality oflight emitting diodes are electrically coupled in parallel between thepositive and negative electrically conductive pads, and/or wherein atleast two strings of the plurality of light emitting diodes areelectrically coupled in parallel between the positive and negativeelectrically conductive pads.
 51. The electronic device according toclaim 44 wherein at least one of the light emitting diodes comprises ananode contact electrically and mechanically coupled to the packagingsubstrate using a first metallic bond physically located between theanode contact and the packaging substrate and a cathode contactelectrically and mechanically coupled to the packaging substrate using asecond metallic bond physically located between the cathode contact andthe packaging substrate.
 52. The electronic device according to claim 44wherein each of the plurality of light emitting diodes comprises, adiode region having first and second opposing faces including therein ann-type layer and a p-type layer, an anode contact that ohmicallycontacts the p-type layer and extends on the first face, a cathodecontact that ohmically contacts the n-type layer and extends on thefirst face, and a support substrate on the second face of the dioderegion, wherein the diode region is between the support substrate andthe anode and cathode contacts, and wherein the support substrate has athickness of at least about 50 micrometers.
 53. The electronic device ofclaim 52 wherein for each of the plurality of light emitting diodes, thediode region is between the support substrate and the packagingsubstrate, a phosphor layer is coated on the support substrate, and thepackaging substrate is free of wirebonds electrically coupled betweenthe packaging substrate and the light emitting diode.
 54. The electronicdevice according to claim 44 further comprising: a continuous opticalcoating on the plurality of light emitting diodes, wherein thecontinuous optical coating comprises a layer of a transparent and/ortranslucent material including a phosphor material therein, wherein athickness of the continuous optical coating relative to the packagingface of the packaging substrate is greater than a thickness of each ofthe plurality of light emitting diodes relative to the packaging face ofthe packaging substrate, and wherein a surface of the continuous opticalcoating opposite the packaging substrate is substantially planar over anarea including the plurality of light emitting diodes.
 55. Theelectronic device according to claim 54 further comprising: a damsurrounding the plurality of light emitting diodes, wherein thecontinuous optical coating is confined within the dam.
 56. Theelectronic device of claim 54 wherein the continuous optical coatingcomprises a layer of a transparent and/or translucent material includingmultiple different phosphor materials therein, wherein each of thedifferent phosphor materials is configured to emit a respectivedifferent wavelength of light responsive to light generated by theplurality of light emitting diodes.
 57. An electronic device comprising:a packaging substrate having a packaging face, the packaging substrateincluding positive and negative electrically conductive pads on thepackaging face; and first and second pluralities of light emittingdiodes electrically and mechanically coupled to the packaging face ofthe packaging substrate, wherein the first plurality of light emittingdiodes are electrically coupled in parallel between the positiveelectrically conductive pad and an interconnection structure on thepackaging face, wherein the second plurality of light emitting diodesare electrically coupled in parallel between the interconnectionstructure and the negative electrically conductive pad, and wherein thepackaging substrate is free of wirebonds electrically coupled betweenthe packaging substrate and any of the first and second pluralities oflight emitting diodes.
 58. The electronic device of claim 57 wherein thefirst plurality of light emitting diodes includes a first plurality ofserially coupled strings of light emitting diodes with each seriallycoupled string of light emitting diodes of the first plurality includingrespective light emitting diodes electrically coupled in series betweenthe positive electrically conductive pad and the interconnectionstructure, and wherein the second plurality of light emitting diodesincludes a second plurality of serially coupled strings of lightemitting diodes with each serially coupled string of light emittingdiodes of the second plurality including respective light emittingdiodes electrically coupled in series between the interconnectionstructure and the negative electrically conductive pad.
 59. Theelectronic device according to claim 57 wherein the interconnectionstructure comprise a first interconnection structure, and wherein thesecond plurality of light emitting diodes are electrically coupled inparallel between the first interconnection structure and a secondinterconnection structure, the electronic device further comprising: athird plurality of light emitting diodes electrically and mechanicallycoupled to the packaging face of the packaging substrate, wherein thethird plurality of light emitting diodes are electrically coupled inparallel between the second interconnection structure and the negativeelectrically conductive pad.
 60. The electronic device according toclaim 57 wherein each of the light emitting diodes of the first andsecond pluralities comprises an anode contact electrically andmechanically coupled to the packaging substrate using a first metallicbond physically located between the anode contact and the packagingsubstrate and a cathode contact electrically and mechanically coupled tothe packaging substrate using a second metallic bond physically locatedbetween the cathode contact and the packaging substrate.